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K4B1G0846FHCK0

Part No K4B1G0846FHCK0
Manufacturer Samsung
Catalog OEM Parts (J - L)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1066652-K4B1G0846FHCK0
Categories OEM Parts(J-L)
Manufacturer Samsung
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian K4B1G0846FHCK0 CAD Model

Description

The K4B1G0846F-HCK0 is a 1Gbit DDR3 SDRAM component manufactured by Samsung. It is a high-speed dynamic random-access memory designed for a wide range of applications requiring substantial memory bandwidth and capacity. This particular chip configuration features an 8-bit data width and operates according to the DDR3 standard, offering improved performance and power efficiency compared to previous DDR generations.

Applications

  • Desktop and Laptop Computers: Used as main system memory to enable smooth multitasking and efficient application performance.
  • Gaming Consoles: Provides the necessary bandwidth for rendering complex graphics and handling large game assets.
  • Networking Equipment: Employed in routers, switches, and other network devices to buffer and process data packets.
  • Embedded Systems: Integrated into various embedded applications, including industrial control systems and automotive electronics, where high-speed memory is crucial.
  • Graphics Cards: Serves as video memory to store textures, frame buffers, and other graphical data for rendering.

Features

  • Capacity: 1Gbit (128M x 8) memory capacity.
  • DDR3 Technology: Compliant with the DDR3 SDRAM standard, ensuring high-speed data transfer rates.
  • Data Width: 8-bit data width, suitable for various memory configurations.
  • Operating Speed: Supports data transfer rates up to a specified frequency (research needed for specific speed grade of HCK0).
  • Low Power Consumption: Designed to minimize power consumption, making it suitable for mobile and energy-efficient applications.
  • Lead-Free and RoHS Compliant: Environmentally friendly, meeting lead-free and RoHS standards.

Benefits

  • Increased System Performance: Enables faster data access and processing, resulting in improved overall system performance.
  • Enhanced Multitasking: Allows users to run multiple applications simultaneously without performance degradation.
  • Improved Gaming Experience: Delivers smooth and responsive gaming performance with high-resolution graphics.
  • Energy Efficiency: Reduces power consumption, leading to longer battery life in mobile devices and lower energy costs in desktop systems.
  • Reliable Operation: Provides stable and reliable memory operation, ensuring data integrity and system stability.

Additional Details

The K4B1G0846F-HCK0 operates at a specific voltage, typically 1.5V for standard DDR3, contributing to its power efficiency. It utilizes a double data rate architecture to achieve high data transfer rates, effectively doubling the bandwidth compared to single data rate SDRAM. The chip is typically packaged in a FBGA (Fine-pitch Ball Grid Array) for efficient board mounting and signal integrity. Timing parameters such as CAS latency (CL), RAS to CAS delay (tRCD), and RAS precharge time (tRP) are critical for proper memory operation and must be configured according to the manufacturer's specifications. Refer to the official Samsung datasheet for detailed specifications and timing diagrams. The HCK0 suffix denotes a particular speed grade and operating temperature range, which needs to be confirmed via the datasheet.

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