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K4X2G323PDKGD8

Part No K4X2G323PDKGD8
Manufacturer Samsung
Catalog OEM Parts (J - L)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1066777-K4X2G323PDKGD8
Categories OEM Parts(J-L)
Manufacturer Samsung
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian K4X2G323PDKGD8 CAD Model

Description

The Samsung K4X2G323PD-KGD8 is a 2Gb (Gigabit) DDR3 SDRAM memory chip. It's designed for high-performance applications where large memory capacity and fast data transfer rates are crucial. As a DDR3 SDRAM, it offers significant improvements in speed and bandwidth over previous generations of memory technology. It is manufactured by Samsung, a reputable and leading memory solution provider.

Applications

  • High-performance computing
  • Gaming laptops and desktops
  • Graphics cards
  • Server memory
  • Advanced mobile devices

Features

  • 2Gb Density: Provides a substantial memory capacity for demanding applications.
  • DDR3 Technology: Offers faster clock speeds and data transfer rates compared to DDR2.
  • Low Voltage Operation: Typically operates at 1.5V, reducing power consumption.
  • Multiple Banks: Organized into multiple internal banks for concurrent access and improved performance.
  • JEDEC Standard: Complies with industry standards to ensure compatibility with a wide range of systems.

Benefits

  • Enhanced Performance: Enables faster data access and processing, leading to improved overall system performance.
  • Increased Bandwidth: Provides a higher data transfer rate, crucial for graphics-intensive applications.
  • Power Efficiency: Reduces power consumption, contributing to longer battery life in portable devices.
  • Reliability: Samsung's reputation for quality ensures a reliable memory solution.
  • Compatibility: JEDEC compliance ensures seamless integration with existing systems.

Additional Details

The K4X2G323PD-KGD8 operates at a clock frequency of up to 800 MHz (DDR3-1600). It has a 32-bit data width, allowing for efficient data transfer. It typically comes in a FBGA (Fine-Pitch Ball Grid Array) package for surface mounting on PCBs. The operating temperature range is usually between 0°C and 85°C, making it suitable for various operating environments.

This memory chip is vital for applications requiring high speed and substantial memory. Its presence ensures system responsiveness and efficient handling of demanding tasks.

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