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SEAF8-30-1-S-10-2-RA-GP

Part No SEAF8-30-1-S-10-2-RA-GP
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Mfr Samtec Inc.
Series SEARAY™ SEAF
Package Tape & Reel (TR)
Connector Type High Density Array, Female
Number of Positions 300
Pitch 0.031" (0.80mm)
Number of Rows 10
Mounting Type Surface Mount, Right Angle
Features Board Guide, Mating Flange
Contact Finish Gold
Contact Finish Thickness 30.0µin (0.76µm)
Base Product Number SEAF8-30
Standard Package 75
MSL Level 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Win Source Part Number 1293643-SEAF8-30-1-S-10-2-RA-GP
Ultra Librarian 3D Model Ultra Librarian SEAF8-30-1-S-10-2-RA-GP CAD Model

Description

The SEAF8-30-1-S-10-2-RA-GP is a right-angle, high-density, open-pin-field array connector from Samtec Inc., part of their SEARAY™ family. This connector is designed for demanding applications requiring high-speed data transmission and reliable board-to-board connections. It features a fine pitch, right-angle termination, and gold-plated contacts for optimal signal integrity. The GP suffix typically denotes a guide post option.

Applications

  • High-speed backplanes in servers and data centers
  • Networking equipment
  • Telecommunications infrastructure
  • Medical imaging equipment
  • Industrial automation

Features

  • High-density open-pin-field array
  • Right-angle termination for design flexibility
  • Gold-plated contacts for optimal signal integrity
  • Robust construction for demanding environments
  • Guide posts for precise alignment

Benefits

  • Enables high-speed data transmission
  • Provides reliable and stable connections
  • Offers design flexibility with right-angle termination
  • Ensures long-term performance and durability
  • Facilitates precise alignment during assembly

Additional Details

The SEAF8-30-1-S-10-2-RA-GP connector is designed to meet the stringent requirements of high-speed applications. The fine pitch allows for increased density, reducing the overall size of the board. The right-angle termination provides design flexibility, allowing for connections in tight spaces. The gold-plated contacts provide excellent conductivity and corrosion resistance, ensuring optimal signal integrity. The guide posts facilitate precise alignment during assembly.

This connector is part of Samtec's extensive line of high-performance interconnect solutions. It is designed to provide a reliable and cost-effective solution for a wide range of applications. It mates with Samtec's SEAM series. The SEAF series is a very common high density open pin field array system from Samtec.

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