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SKY77559-11

Part No SKY77559-11
Manufacturer Skyworks Solutions Inc.
Catalog HOT - SALES and EOL Components (S)
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Manufacturer Skyworks Solutions Inc.
Win Source Part Number 325035-SKY77559-11
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian SKY77559-11 CAD Model

Description

The SKY77559-11 is a Power Amplifier Module (PAM) from Skyworks Solutions Inc., crafted for multimode multiband (MMMB) operation in cellular devices. This PAM is specifically designed to support 2G, 3G, and 4G technologies, delivering robust and efficient amplification of RF signals necessary for transmitting data and voice. It is a crucial component in modern smartphones and other mobile communication devices, enabling seamless connectivity across a range of network frequencies.

Applications

  • Smartphones
  • Feature phones
  • Cellular-enabled tablets
  • Mobile hotspots
  • Data cards and USB dongles

Features

  • Multi-band support: Operates across various GSM, EDGE, UMTS, and LTE frequency bands.
  • High power efficiency: Optimizes battery life through efficient RF amplification.
  • Integrated power control: Enables precise output power adjustment for optimal performance.
  • Compact module size: Facilitates integration into smaller, sleeker device designs.
  • Low leakage current: Reduces power consumption during idle or standby modes.
  • Internal matching network

Benefits

  • Enhanced call quality and data speeds: Reliable RF amplification ensures clear communication and faster data transmission.
  • Extended battery runtime: High efficiency minimizes power drain.
  • Simplified design process: Integrated functionality reduces design complexity.
  • Reduced component count: Streamlines manufacturing and lowers BOM costs.
  • Improved device reliability: Robust design ensures consistent performance.

Additional Details

The SKY77559-11 is engineered to operate within specified voltage parameters (typically 3.2V to 4.8V) and adheres to stringent RF emission standards. It incorporates advanced packaging technology for excellent thermal dissipation and operational stability. The integrated matching networks simplify impedance matching, reducing the need for external components and streamlining the PCB layout. The power control circuitry enables the dynamic adjustment of output power, adapting to varying network conditions and minimizing interference. This PAM consists of multiple amplifier stages, filters, and matching components within a single module. It ensures efficient and dependable wireless communication, making it a vital component in current mobile technology.

The device's ability to support multiple bands and modes makes it a versatile solution for global mobile communication. Its compact size and high efficiency are critical factors for integration into modern, power-conscious mobile devices.

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Pricing & Ordering

Quantity Unit Price Ext. Price
35+ $1.5763 $55.1705
80+ $1.2934 $103.4720
120+ $1.2530 $150.3600
165+ $1.2126 $200.0790
215+ $1.1722 $252.0230
290+ $1.0509 $304.7610
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 3,100 pieces
MOQ: 35 pcs
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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