The WPN252010HR33MTY01 is a wire-wound chip inductor manufactured by Sunlord. It's designed for high-frequency applications, providing excellent electrical characteristics in a compact size. Its 2520 package size makes it ideal for applications where board space is limited.
Applications
- RF Modules: Used for impedance matching, filtering, and tuning in RF modules.
- Wireless Communication Devices: Found in smartphones and tablets for signal processing and noise reduction.
- Bluetooth Applications: Implemented in Bluetooth modules for efficient signal transmission.
- Wi-Fi Devices: Used in WLAN modules for impedance matching and filtering.
- GPS Devices: Incorporated in GPS receivers for signal conditioning and filtering.
Features
- Compact Size: The 2520 (2.5 x 2.0 x 1.0 mm) package offers a small footprint.
- High Q Value: Ensures minimal signal loss in high-frequency circuits.
- Tight Inductance Tolerance: Provides consistent performance across different inductors.
- Excellent SRF: High Self-Resonant Frequency ensures optimal performance at high frequencies.
- RoHS Compliant: Meets environmental standards for lead-free manufacturing.
Benefits
- Improved Signal Integrity: High Q value minimizes signal distortion and loss.
- Reduced Board Space: Compact size enables higher component density.
- Stable Circuit Performance: Tight inductance tolerance guarantees consistent behavior.
- Optimized High-Frequency Response: Excellent SRF enables use in high-frequency applications.
- Environmentally Friendly: RoHS compliance contributes to sustainable manufacturing.
Technical Specifications: The WPN252010HR33MTY01 features an inductance value of 0.33 μH. Its high Q-factor and SRF (Self-Resonant Frequency) make it suitable for various high-frequency applications. The specific SRF and DCR (DC Resistance) values are detailed in the manufacturer's datasheet. The inductor is constructed with a ceramic core and precisely wound coil to achieve its electrical properties. It is designed for reflow soldering and withstands the high temperatures involved in the process.