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SSM3K7002FU(T5L.F)

Part No SSM3K7002FU(T5L.F)
Manufacturer Toshiba Semiconductor and Storage
Catalog FETs - Single
Sample
Rohs State rohs
ECAD Module
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Manufacturer Toshiba Semiconductor and Storage
Category Discrete Semiconductor Products
Family FETs - Single
Win Source Part Number 193037-SSM3K7002FU(T5L.F)
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian SSM3K7002FU(T5L.F) CAD Model

Description

The SSM3K7002FU(T5L.F) is a silicon N-Channel MOSFET from Toshiba Semiconductor and Storage, primarily designed for low voltage switching applications in compact and portable electronic devices. The (T5L.F) suffix likely indicates a specific tape and reel option for automated assembly.

Applications

  • Low-Voltage Switching
  • Load Switching
  • Power Management
  • DC-DC Converters
  • Portable Electronics

Features

  • Low Drain-Source On-Resistance: Reduces power loss and improves energy efficiency.
  • Small Surface Mount Package: Allows for high-density mounting and miniaturization of circuits.
  • Enhancement Mode: Simplifies gate drive circuitry, minimizing component count.
  • Low Threshold Voltage: Facilitates operation with low-voltage logic signals, making it suitable for battery-powered applications.

Benefits

  • Enhanced Energy Efficiency: Minimizing power dissipation through low on-resistance leads to improved overall energy efficiency.
  • Compact Design: The small package allows for the creation of smaller, more portable electronic devices.
  • Simplified Circuit Design: The enhancement mode simplifies the design and implementation of gate drive circuits.
  • Compatibility with Low-Voltage Logic: Operates effectively with low-voltage logic signals, making it ideal for modern battery-powered systems.

Additional Details

The SSM3K7002FU(T5L.F) is commonly utilized in load switches, DC-DC converters, and power management functions within portable electronics. Its low threshold voltage allows for direct drive from low-voltage logic circuits, simplifying the design process. The small surface mount package is optimized for automated assembly and high-density PCB layouts. Consult the device datasheet for comprehensive electrical specifications, thermal performance data, and safe operating area guidelines.

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