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GD74LS245D

Part No GD74LS245D
Manufacturer Vishay
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1060678-GD74LS245D
Categories OEM Parts(F-I)
Manufacturer Vishay
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian GD74LS245D CAD Model

Description

The GD74LS245D is an octal bus transceiver designed for asynchronous two-way communication between data buses. It features eight bidirectional channels with three-state outputs, providing isolation when disabled. A direction control input (DIR) determines the direction of data flow, while an output enable input (OE) controls whether the outputs are enabled or disabled (high-impedance state). This device is commonly used to buffer memory addresses or data inputs/outputs to microprocessors.

Applications:

  • Memory interfacing
  • Data bus buffering
  • Microprocessor systems
  • Peripheral interfacing
  • Data transmission

Features:

  • Bidirectional Bus Transceiver: Allows data transfer in both directions.
  • Three-State Outputs: Provides isolation when disabled.
  • High-Speed Operation: Improves system performance.
  • Low Power Dissipation: Reduces overall power consumption.
  • TTL Compatible Inputs and Outputs: Ensures easy interfacing with TTL logic.
  • Direction Control Input: Selects the direction of data flow.
  • Output Enable Input: Enables or disables the outputs.

Benefits:

  • Simplifies data bus interfacing.
  • Improves system performance by buffering signals.
  • Reduces loading on the data bus.
  • Provides isolation between buses.
  • Increases system reliability.

Additional Details:

The GD74LS245D is typically used in applications where multiple devices need to share a common data bus. The three-state outputs prevent bus contention when the device is disabled. The direction control input allows the direction of data flow to be dynamically changed. The output enable input can be used to disable the device when it is not needed, further reducing power consumption. It is available in various packages, including DIP and SOIC.

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