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Same model may have multiple batches, images only for reference.
W988D2FBJX6I Winbond Electronics
Same model may have multiple batches, images only for reference.

W988D2FBJX6I

Part No W988D2FBJX6I
Manufacturer Winbond Electronics
Catalog Memory
Description IC DRAM 256MBIT PAR 90VFBGA / SDRAM - Mobile LPSDR Memory IC 256Mbit Parallel 166 MHz 5.4 ns 90-VFBGA (8x13)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Winbond Electronics
Series -
Package Tray
Product Status Obsolete
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPSDR
Memory Size 256Mbit
Memory Organization 8M x 32
Memory Interface Parallel
Clock Frequency 166 MHz
Write Cycle Time - Word, Page 15ns
Access Time 5.4 ns
Voltage - Supply 1.7V ~ 1.95V
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 90-TFBGA
Supplier Device Package 90-VFBGA (8x13)
Base Product Number W988D2
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0002
Win Source Part Number 1354017-W988D2FBJX6I
Ultra Librarian 3D Model Ultra Librarian W988D2FBJX6I CAD Model

Description

The W988D2FBJX6I is a memory integrated circuit (IC) manufactured by Winbond Electronics.

  • Memory Type: Volatile
  • Memory Format: DRAM
  • Memory Size: 256Mbit
  • Organization: 8M x 32
  • Interface: Parallel
  • Clock Frequency: 166 MHz
  • Write Cycle Time: 15ns
  • Access Time: 5.4 ns
  • Voltage Supply: 1.7V to 1.95V
  • Mounting Type: Surface Mount
  • Package: 90-TFBGA
  • Technology: SDRAM - Mobile LPSDR
  • Operating Temperature: -40°C to 85°C
  • Status: Obsolete
  • Packaging: Tray
  • REACH: Unaffected
  • ECCN: EAR99

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