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XC2VP30-5FFG1152I

Part No XC2VP30-5FFG1152I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 644 I/O 1152FCBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Features series Field Programmable Gate Array (FPGA) IC 644 2506752 30816 1152-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex®-II Pro
Package Tray
Part Status Obsolete
Number of I/O 644
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 1152-BBGA, FCBGA
Case / Package 1152-FCBGA (35x35)
Family Name XC2VP30
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Quantity per package 1
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939268-XC2VP30-5FFG1152I
Ultra Librarian 3D Model Ultra Librarian XC2VP30-5FFG1152I CAD Model

Description

The XC2VP30-5FFG1152I is a Virtex-II Pro series FPGA from Xilinx. This FPGA integrates both FPGA fabric and PowerPC processor cores, offering a versatile solution for embedded systems. The 'FFG1152' designates a Flip-Chip Fine-Pitch Ball Grid Array package with 1152 pins. The 'I' indicates that it is rated for the industrial temperature range.

Applications:

  • Aerospace and Defense: Used in radar systems, signal processing, and embedded control systems requiring high performance and reliability.
  • Wireless Communications: Implemented in base stations and wireless infrastructure equipment for signal processing and protocol handling.
  • Industrial Automation: Utilized in industrial control systems, robotics, and machine vision applications for real-time processing and control.
  • Networking: Employed in routers, switches, and network interface cards for high-speed data processing and packet handling.
  • Medical Imaging: Integrated into medical imaging equipment for image processing, analysis, and display.

Features:

  • Integrated PowerPC Processors: Includes embedded PowerPC processor cores for high-performance processing.
  • High Logic Density: Provides a large number of programmable logic resources for implementing complex digital designs.
  • Embedded Memory: Features on-chip block RAM and distributed RAM for high-speed data storage and retrieval.
  • High-Speed Serial Interfaces: Integrates RocketIO multi-gigabit transceivers for high-bandwidth serial communication.
  • Flexible I/O: Supports a wide range of I/O standards, enabling seamless connectivity to external devices.

Benefits:

  • Reduced System Size: Integrates both processor and FPGA functionality onto a single chip, reducing board space.
  • Increased Performance: Combines high-speed processing with flexible logic implementation.
  • Enhanced Flexibility: Offers a high degree of programmability for customized solutions.
  • Faster Development Time: Allows for rapid prototyping and development of embedded systems.
  • Improved Reliability: Provides robust performance in demanding industrial environments.

Additional Details:

The XC2VP30-5FFG1152I features 3,081,600 system gates and contains two embedded PowerPC cores. It features 28,672 logic cells. The available distributed RAM is 1,486,080 bits. This device provides 716 available I/O pins. The core voltage for the FPGA fabric is 1.5V, and the processor core voltage is 1.8V. The speed grade is -5.

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