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Same model may have multiple batches, images only for reference.
XCZU6CG-L2FFVC900E Real Image
Same model may have multiple batches, images only for reference.

XCZU6CG-L2FFVC900E

Part No XCZU6CG-L2FFVC900E
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)
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Category Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Manufacturer AMD Xilinx
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Case / Package 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU6
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1318092-XCZU6CG-L2FFVC900E
Ultra Librarian 3D Model Ultra Librarian XCZU6CG-L2FFVC900E CAD Model

Description

The AMD Xilinx XCZU6CG-L2FFVC900E is a system-on-chip (SoC) that combines a Zynq UltraScale+ FPGA with dual ARM Cortex-A53 MPCore and dual ARM Cortex-R5 processors.

  • I/O Pins: 204
  • Logic Cells: 469K+
  • RAM Size: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Package: 900-FCBGA
  • Operating Temperature: 0°C to 100°C
  • Compliance: RoHS3 standard.

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1+ $291.2610 $291.2610
2+ $261.1305 $522.2610
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