The 1111SQ-27NGEC is a surface mount inductor manufactured by Coilcraft. This inductor is designed for use in high-frequency applications, offering excellent performance characteristics and a compact size. It is part of Coilcraft's SQ series, known for their high Q and low DC resistance.

Applications

• RF filters.
• Impedance matching networks.
• Oscillators.
• Wireless communication devices (e.g., Bluetooth, Wi-Fi).
• Broadband amplifiers.

Features

• Surface Mount Design. Facilitates automated assembly and reduces board space.
• High Q Value. Ensures low energy loss and efficient circuit performance.
• Low DC Resistance. Minimizes power dissipation and improves efficiency.
• Tight Tolerance. Provides consistent and predictable performance.
• Shielded Construction. Reduces electromagnetic interference (EMI).
• Ceramic Core. Offers excellent stability and high-frequency performance.

Benefits

• Improved Circuit Performance. High Q and low DC resistance optimize signal integrity and minimize losses.
• Reduced EMI. Shielded construction helps prevent interference with other components.
• Simplified Assembly. Surface mount design streamlines the manufacturing process.
• Compact Design. Small size allows for high-density circuit layouts.
• Reliable Operation. Stable ceramic core ensures consistent performance over a wide temperature range.

Additional Details

The 1111SQ-27NGEC inductor has an inductance value of 27 nH. The typical Q value is very high, maximizing efficiency in tuned circuits. Its self-resonant frequency is also notably high, enabling its use in very high frequency applications. The component is constructed with a ceramic core which is known for its stability under varying environmental conditions, including temperature fluctuations. The shielded design minimizes magnetic field radiation, making it suitable for use in sensitive applications where electromagnetic compatibility is a concern. The part is typically used in matching networks for RF transceivers and in filters designed to attenuate unwanted signals. The physical dimensions of the component are small, typically 0.115" x 0.115", making it suitable for dense circuit board layouts. The solder pads are designed for standard surface mount assembly techniques.