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S29GL256P11TFIV23

Part No S29GL256P11TFIV23
Manufacturer Cypress Semiconductor Corp
Catalog Unclassified Memory
Description IC FLASH 256MBIT PARALLEL 56TSOP  /  FLASH - NOR Memory IC 256Mb (32M x 8) Parallel 110 ns 56-TSOP
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Memory
Mfr Cypress Semiconductor Corp
Series GL-P
Package Tape & Reel (TR)
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mb (32M x 8)
Memory Interface Parallel
Write Cycle Time - Word, Page 110ns
Access Time 110 ns
Voltage - Supply 1.65V ~ 3.6V
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting SMD (SMT)
Package / Case 56-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 56-TSOP
Base Product Number S29GL256
Standard Package 1,000
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Win Source Part Number 1255008-S29GL256P11TFIV23
Ultra Librarian 3D Model Ultra Librarian S29GL256P11TFIV23 CAD Model

Description

The S29GL256P11TFIV23 is a 256 Mbit (32 MB) NOR flash memory device manufactured by Cypress Semiconductor Corp. This memory is designed for high-performance applications, providing fast read access and reliable data storage. It's commonly used in embedded systems where code execution directly from flash memory (XIP) is required.

Applications

  • Embedded systems: For storing boot code, operating systems, and application data.
  • Networking equipment: For storing firmware and configuration settings in devices like routers and switches.
  • Industrial control systems: For storing program code and data in industrial automation equipment.
  • Automotive applications: For storing firmware and calibration data in automotive control units.
  • Medical devices: For storing software and data in medical instruments.

Features

  • 256 Mbit (32 MB) capacity
  • NOR flash architecture
  • Fast read access time
  • Operating Voltage: 2.7V to 3.6V
  • Operating Temperature: -40°C to +85°C
  • Sector erase and chip erase operations
  • Common Flash Interface (CFI) for simplified system integration
  • 64-Ball Fine-Pitch Ball Grid Array (FBGA) package

Benefits

  • Fast Read Performance: Enables quick boot times and efficient code execution directly from flash memory.
  • High Reliability: Ensures data integrity and long-term storage stability.
  • Compact Package: The FBGA package allows for high-density mounting on circuit boards.
  • Wide Operating Temperature Range: Suitable for use in demanding industrial and automotive environments.
  • Easy Integration: The Common Flash Interface simplifies system integration and reduces development time.
  • Security features: Enhanced security options to protect the stored data and prevent unauthorized access.

Additional Details

The S29GL256P11TFIV23 is designed to meet the stringent requirements of embedded systems. Its NOR flash architecture supports random access reads, making it ideal for applications where code is executed directly from the flash memory. The device also supports sector erase and chip erase operations, providing flexibility in managing the memory contents. The 64-Ball FBGA package allows for compact mounting on circuit boards, saving valuable space. The operating voltage is 2.7V to 3.6V, and the operating temperature range is -40°C to +85°C. It's a Pb-free and RoHS compliant device.

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Pricing & Ordering

Quantity Unit Price Ext. Price
5+ $13.0115 $65.0575
11+ $10.6761 $117.4371
17+ $10.3425 $175.8225
24+ $10.0089 $240.2136
30+ $9.6752 $290.2560
40+ $8.6743 $346.9720
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Availability: 6,190 pieces
MOQ: 5 pcs
Order Increment : 1 pcs
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