The FDPF10N60 is a N-Channel MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) from Fairchild Semiconductor (now ON Semiconductor). It is designed for high-voltage, high-speed switching applications, offering efficient performance and robust operation. This MOSFET is commonly used in power supplies, motor control circuits, and other applications requiring fast and efficient switching.

Applications

• Switch Mode Power Supplies (SMPS)
• Uninterruptible Power Supplies (UPS)
• Motor control circuits
• Power factor correction (PFC) circuits
• High-voltage DC-DC converters

Features

• N-Channel enhancement mode MOSFET
• High voltage rating (600V)
• Low on-resistance (RDS(on))
• Fast switching speed
• High avalanche energy capability
• TO-220F package (fully isolated)
• RoHS compliant

Benefits

• Efficient power switching reduces energy loss and heat generation.
• High voltage rating allows for use in high-voltage applications.
• Low on-resistance minimizes conduction losses, improving efficiency.
• Fast switching speed reduces switching losses, further improving efficiency.
• High avalanche energy capability provides robustness against voltage spikes.
• Fully isolated package simplifies heatsinking and improves safety.
• RoHS compliance ensures environmental friendliness.

Additional Details

The FDPF10N60 has a drain-source voltage (VDS) rating of 600V and a continuous drain current (ID) rating of 10A. The on-resistance (RDS(on)) is typically 0.75 Ohms at a gate-source voltage (VGS) of 10V. The gate threshold voltage (VGS(th)) is typically between 2V and 4V. The input capacitance (Ciss) is typically around 1000 pF. The TO-220F package provides good thermal performance and electrical isolation. This MOSFET is designed to operate at high switching frequencies, making it suitable for modern power electronics applications. The avalanche energy rating ensures that the device can withstand occasional voltage transients without damage. The fully isolated package allows direct mounting to heatsinks without additional insulation, simplifying assembly and improving thermal management.