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2021\512MB\32Mx8\16C

Part No 2021\512MB\32Mx8\16C
Manufacturer Hynix Semiconductor
Catalog Memory - Modules
Description PC133 64Mx64-H
Sample
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ECAD Module
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Categories Memory - Modules
Win Source Part Number 952044-2021\512MB\32Mx8\16C
Series *
Ultra Librarian 3D Model Ultra Librarian 2021\512MB\32Mx8\16C CAD Model

Description

The 2021\512MB\32Mx8\16C is a 512MB DDR SDRAM memory module manufactured by Hynix Semiconductor. This module is designed for use in a variety of computing devices, including desktops, laptops, and embedded systems, where reliable and efficient memory performance is required. The module's configuration of 32Mx8 indicates that it consists of 32 million words, each 8 bits wide.

Applications:

  • Desktop PCs
  • Laptop Computers
  • Embedded Systems
  • Industrial Control Systems
  • Networking Devices

Features:

  • 512MB Capacity
  • DDR SDRAM Technology
  • 32Mx8 Configuration
  • 16 Chip Configuration
  • High-Speed Data Transfer
  • Low Power Consumption

Benefits:

  • Increased System Responsiveness
  • Improved Multitasking Performance
  • Enhanced Application Loading Times
  • Reduced Latency
  • Stable Operation

Additional Details:

This memory module likely operates at a standard DDR voltage (typically 2.5V), and its speed depends on the specific DDR generation (e.g., DDR, DDR2, DDR3). The 16C likely refers to the number of chips on the module. DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) technology allows for faster data transfer rates compared to older SDRAM technologies by transferring data on both the rising and falling edges of the clock signal.

Technical Specifications:

  • Capacity: 512MB
  • Memory Type: DDR SDRAM
  • Configuration: 32Mx8
  • Number of Chips: 16
  • Voltage: Typically 2.5V (consult datasheet for exact value)
  • Operating Temperature: 0°C to 70°C (commercial) or -40°C to 85°C (industrial, if applicable)
  • Module Type: DIMM or SODIMM (depending on the application)

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