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Same model may have multiple batches, images only for reference.
EP2C5AF256I8N Real Image
Same model may have multiple batches, images only for reference.

EP2C5AF256I8N

Part No EP2C5AF256I8N
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 158 I/O 256FBGA
Datasheet
EP2C5AF256I8N Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 158 119808 4608 256-LBGA
Manufacturer Intel
Series Cyclone® II
Package Tray
Number of I/O 158
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 256-LBGA
Case / Package 256-FBGA (17x17)
Family Name EP2C5
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 90
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 870525-EP2C5AF256I8N
Ultra Librarian 3D Model Ultra Librarian EP2C5AF256I8N CAD Model

Description

The EP2C5AF256I8N Cyclone® II series field-programmable gate array (FPGA) IC from Intel comes in a 256-LBGA package and is mounted using surface mount technology.

  • Package: 256-LBGA
  • Mounting: Surface Mount
  • I/Os: 158
  • Family: EP2C5
  • ECCN: 3A991D
  • Popularity: Medium
  • Package Quantity: 90
  • MSL Level: 3 (168 hours)
  • Estimated Production Lead Time: 51 weeks
  • REACH: Unaffected
  • HTSUS: 8542.39.0001

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