The TE28F160C3TD90 is a 16-Mbit (2M x 8 or 1M x 16) Flash memory device manufactured by Intel. This device is designed for embedded systems requiring non-volatile storage for code and data. The 'TE' prefix generally indicates a specific family of Intel flash memory, and '160C3' signifies the density and architecture of the memory. The 'TD90' suffix refers to timing characteristics.

Applications

• Embedded Systems: Used for storing firmware, configuration data, and application code.
• Networking Equipment: Stores boot code and configuration parameters in routers and switches.
• Industrial Automation: Stores program code and data in industrial control systems.
• Consumer Electronics: Used in set-top boxes, digital TVs, and other consumer devices.
• Automotive Electronics: Stores software and calibration data in automotive control units (ECUs).

Features

• 16-Mbit Density: Provides 16 megabits of non-volatile storage capacity.
• Page Mode Operation: Allows for fast page writes and reads.
• x8 or x16 Bus Width: Supports both 8-bit and 16-bit data bus configurations.
• Erase Suspend Capability: Allows for interruption of the erase cycle for faster system response.
• Hardware Reset: Provides a hardware reset input for system initialization.
• Sector Protection: Protects individual sectors from accidental erasure or programming.

Benefits

• Non-Volatile Storage: Retains data even when power is removed.
• Fast Read Access: Enables quick retrieval of stored code and data.
• High Endurance: Withstands a large number of program/erase cycles.
• Flexible Architecture: Supports various memory organizations and bus widths.
• Reliable Operation: Designed for long-term data retention and reliable performance.

Additional Details

The TE28F160C3TD90 operates within a specific voltage range and requires a stable power supply. The device features a command set for programming, erasing, and reading data. Erase and program operations typically involve specific timing requirements. Sector protection mechanisms prevent accidental overwrites of critical data. Detailed specifications regarding read access time, program/erase time, and endurance can be found in the product datasheet provided by Intel. Proper handling and soldering techniques are essential to avoid damaging the device. The device is available in various package options, including TSOP (Thin Small Outline Package) and PLCC (Plastic Leaded Chip Carrier).