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LFEC33E-4FN672C

Part No LFEC33E-4FN672C
Manufacturer Lattice Semiconductor Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description LatticeECP/EC Family Data Sheet | IC FPGA 496 I/O 672FPBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits
Manufacturer Lattice Semiconductor Corporation
Status Obsolete
Number of Logic Elements/Cells 32800
Total RAM Bits 434176
The number of I/O 496
Supply Voltage (V) 1.14V ~ 1.26V
Mounting Style SMD
Temperature Range - Operating 0°C ~ 85°C
Manufacturer Package 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Family Part Number LFEC33
Manufacturer Pack Quantity 40
MSL Level 3 (168 Hours)
Win Source Part Number 1196216-LFEC33E-4FN672C
Manufacturer Homepage www.latticesemi.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian LFEC33E-4FN672C CAD Model

Description

The LFEC33E-4FN672C is an FPGA (Field Programmable Gate Array) from Lattice Semiconductor Corporation, belonging to the LatticeECP3 family. It's a versatile and energy-efficient device suitable for a wide range of applications.

Applications:

  • Video Processing: Used in video processing systems for image enhancement, encoding, and decoding.
  • Industrial Automation: Employed in industrial automation equipment for motor control, sensor interfacing, and data acquisition.
  • Communication Systems: Utilized in communication systems for signal processing, protocol conversion, and data transmission.
  • Medical Imaging: Incorporated in medical imaging devices for image processing and analysis.
  • Aerospace and Defense: Found in aerospace and defense applications for signal processing, control systems, and data security.

Features:

  • 3.3K LUTs (Look-Up Tables): Provides 3,300 logic elements for implementing custom logic functions.
  • High-Speed Serial Interfaces: Supports high-speed serial interfaces such as PCI Express and Gigabit Ethernet.
  • Embedded Memory: Features embedded memory blocks for on-chip data storage.
  • DSP Blocks: Includes dedicated DSP blocks for signal processing applications.
  • Low Power Consumption: Consumes minimal power for energy-efficient operation.
  • Flexible I/O: Offers a wide range of I/O options for interfacing with external devices.
  • Advanced Packaging: Housed in a 672-pin Fine-Pitch Ball Grid Array (FBGA) package.

Benefits:

  • High Performance: Delivers high performance for demanding applications.
  • Flexibility: Allows for custom logic implementation and design modifications.
  • Energy Efficiency: Reduces power consumption and extends battery life in portable devices.
  • Fast Time-to-Market: Enables rapid prototyping and product development.
  • Cost-Effectiveness: Provides a cost-effective solution for a wide range of applications.

Additional Details:

The LFEC33E-4FN672C uses a 672-pin FBGA package, facilitating surface mounting. The -4 speed grade indicates a specific performance level. The device supports in-system programming (ISP) for easy configuration updates. It complies with industry standards for environmental compliance. Its configurable logic blocks and routing resources enable designers to implement complex digital circuits.

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