Product Overview: 74AVCM162834DGG,11

The 74AVCM162834DGG,11 is a high-performance, 18-bit universal bus driver designed by NXP Semiconductors, which is renowned for its expertise in creating solutions that lead the semiconductor industry. This product is part of NXP's advanced CMOS technology that offers a blend of high speed and low power consumption, making it an ideal choice for a wide range of applications.

Key Features

• High-Speed CMOS Technology: Built on an advanced CMOS process, this bus driver is optimized for high-speed operation while maintaining low power dissipation.
• 18-Bit Interface: The device features an 18-bit wide interface, providing ample data width for complex data transfer requirements.
• Bus-Hold Functionality: Equipped with bus-hold circuitry, the 74AVCM162834DGG,11 maintains the last active logic state of the inputs when no driving signal is present, eliminating the need for external pull-up or pull-down resistors.
• 3-State Outputs: The inclusion of 3-state outputs allows for connection to a bus-oriented system, enabling the device to either drive the bus, receive from it, or be in a high-impedance state to avoid bus contention.
• Wide Operating Voltage Range: This device supports a broad range of operating voltages, accommodating various system requirements.
• Low Standby Current: The 74AVCM162834DGG,11 is designed to have a low standby current, which is crucial for battery-powered devices and energy-efficient systems.

Applications

The versatility of the 74AVCM162834DGG,11 makes it suitable for a variety of applications, including:

• Memory address drivers
• Data receivers/transmitters for bus interfaces
• Backplane driving
• Microprocessor or microcontroller bus expansion

Quality and Reliability

NXP's commitment to quality ensures that the 74AVCM162834DGG,11 meets the highest standards for reliability and performance. The device is subjected to rigorous testing and validation processes, guaranteeing that it performs to specifications under varying conditions.

Package Information

The product is housed in a 48-pin TSSOP (Thin Shrink Small Outline Package) that is both space-saving and offers excellent thermal performance, ensuring stable operation across its intended applications.