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SPAKXC309VF100A

Part No SPAKXC309VF100A
Manufacturer NXP / Nexperia
Catalog Embedded - DSP (Digital Signal Processors)
Description IC DSP 24BIT 100MHZ 196-MAPBGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - DSP (Digital Signal Processors)
Mfr NXP USA Inc.
Series DSP563xx
Product Status Obsolete
Type Fixed Point
Interface Host Interface, SSI, SCI
Clock Rate 100MHz
Non-Volatile Memory ROM (576B)
On-Chip RAM 24kB
Voltage - I/O 3.30V
Voltage - Core 3.30V
Temperature Range - Operating -40°C ~ 105°C (TJ)
Mounting SMD (SMT)
Package / Case 196-LBGA
Supplier Device Package 196-LBGA (15x15)
Base Product Number SPAKX
Standard Package 2
MSL Level 3 (168 Hours)
ECCN 3A991A2
HTSUS 8542.31.0001
Win Source Part Number 1265157-SPAKXC309VF100A
Ultra Librarian 3D Model Ultra Librarian SPAKXC309VF100A CAD Model

Description

The SPAKXC309VF100A is a high-performance microcontroller unit (MCU) from NXP Semiconductors, designed to meet the demanding requirements of automotive and industrial applications. This robust MCU is based on the Power Architecture core and is engineered to deliver exceptional speed, efficiency, and reliability.

Key Features

  • Core: Power Architecture V1 core that offers a perfect balance between processing power and energy efficiency, making it ideal for a wide range of applications.
  • Clock Speed: With a clock speed of up to 100 MHz, it ensures swift execution of complex tasks, which is critical for real-time applications.
  • Memory: Equipped with a generous amount of integrated memory, including flash and RAM, allowing for efficient code and data storage.
  • I/O Ports: Multiple input/output ports provide the flexibility to connect a variety of peripherals and sensors, expanding its functionality and adaptability.
  • Communication Interfaces: It includes a range of communication interfaces such as CAN, SPI, and I2C, enabling easy integration into existing systems and facilitating communication with other devices.
  • Temperature Range: Designed to operate reliably over an extended temperature range, making it suitable for harsh environments.
  • Package: Available in a robust package that ensures durability and longevity even under strenuous conditions.

Applications

The SPAKXC309VF100A is versatile enough to be used in a multitude of applications, particularly excelling in the automotive sector where it can be used for engine management, transmission control, body control modules, and advanced driver assistance systems (ADAS). Its rugged design also makes it a prime choice for industrial applications such as process control, robotics, and automation systems.

Conclusion

NXP's SPAKXC309VF100A microcontroller stands out with its Power Architecture core, high clock speed, and extensive communication capabilities. It is a reliable and powerful solution that meets the stringent requirements of modern automotive and industrial applications. Its integration capabilities and robust design make it a go-to MCU for developers looking to create sophisticated systems that require high performance and resilience.

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