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MD51V65165E-60TAR

Part No MD51V65165E-60TAR
Manufacturer OKI/Metcal
Catalog Unclassified Memory
Description EDO 4Mx16-50 3.3V 4K TSOP
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 944446-MD51V65165E-60TAR
Series *
Ultra Librarian 3D Model Ultra Librarian MD51V65165E-60TAR CAD Model

Description

The MD51V65165E-60TAR is a high-performance synchronous DRAM (SDRAM) from OKI/Metcal. This memory component is engineered for applications demanding rapid data access and reliable memory operations.

Applications

  • Graphics processing units (GPUs)
  • High-speed networking devices
  • Industrial automation systems
  • Embedded systems with high memory requirements
  • Digital imaging equipment

Features

  • Density: 64Mbit (4M x 16)
  • Operating Speed: 166 MHz (6ns cycle time)
  • Supply Voltage: 3.3V
  • CAS Latency: Programmable (typically 2 or 3)
  • Burst Length: 1, 2, 4, 8, Full Page
  • Auto Precharge and Controlled Precharge
  • LVTTL Compatible Inputs/Outputs
  • Package: TSOP II

Benefits

  • Fast access times improve overall system performance.
  • Low voltage operation reduces power consumption and extends battery life in portable devices.
  • Programmable CAS latency allows optimization for specific system requirements.
  • Flexible burst modes enhance data throughput.
  • Auto and controlled precharge functions simplify memory management.
  • LVTTL compatible I/O ensures easy integration with a wide range of systems.
  • The TSOP II package enables high-density board layouts.

Additional Details

The MD51V65165E-60TAR SDRAM offers a 4M x 16 configuration, providing efficient storage and retrieval of data. The device's 166 MHz operating speed and programmable CAS latency allow for fine-tuning of memory performance. It supports multiple burst lengths to optimize data transfer for various applications. The auto precharge feature simplifies memory management, while the controlled precharge function provides additional flexibility. The LVTTL compatible inputs and outputs ensure seamless integration with other system components. The TSOP II package allows for compact and efficient board designs, making it suitable for a variety of applications.

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