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D65882GC-153

Part No D65882GC-153
Manufacturer Renesas Electronics America
Catalog OEM Parts (C - E)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1054919-D65882GC-153
Categories OEM Parts(C-E)
Manufacturer Renesas Electronics America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian D65882GC-153 CAD Model

Description

The D65882GC-153 is a microcontroller unit (MCU) manufactured by Renesas Electronics America. This MCU is part of Renesas' extensive line of embedded solutions, designed to provide efficient processing and control capabilities for a variety of applications.

Applications

  • Industrial automation systems
  • Motor control applications
  • Consumer electronics
  • Home appliances
  • Automotive subsystems

Features

  • High-Performance Core: Features a robust processing core for efficient execution of instructions.
  • Integrated Memory: Includes on-chip Flash memory and RAM for program storage and data handling.
  • Extensive Peripherals: Offers a wide range of peripherals such as timers, ADCs, DACs, and communication interfaces (UART, SPI, I2C).
  • Low Power Consumption: Designed for energy-efficient operation, suitable for battery-powered applications.
  • Flexible Package Options: Available in various package types to accommodate different board layouts and mounting requirements.

Benefits

  • Efficient Processing: The high-performance core enables rapid execution of control algorithms and data processing tasks.
  • Reduced System Cost: Integrated memory and peripherals minimize the need for external components, reducing overall system cost.
  • Versatile Connectivity: The wide range of communication interfaces allows for seamless integration with other system components.
  • Energy Efficiency: Low power consumption extends battery life in portable applications and reduces energy costs in stationary systems.
  • Scalability: The flexible architecture and package options allow for easy scalability across different application requirements.

Technical Specifications

  • Core Architecture: Details vary depending on the specific MCU variant. Check the datasheet.
  • Operating Frequency: Varies depending on the specific MCU variant. Check the datasheet.
  • Flash Memory: On-chip Flash memory capacity varies; check the datasheet.
  • RAM: On-chip RAM capacity varies; check the datasheet.
  • Operating Voltage: Check the datasheet.
  • Temperature Range: Check the datasheet.
  • Package Type: Check the datasheet.

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Shipping Information

Shipped from HK warehouse
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