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2SB1353

Part No 2SB1353
Manufacturer Rohm Semiconductor
Catalog Hard To Find
Description TAPED POWER TRANSISTOR PACKAGE FOR USE WITH AN AUTOMATIC PLACEMENT MACHINE
Sample
Rohs State Need to verify
ECAD Module
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RoHS State Request Verification
Manufacturer Rohm Semiconductor
Win Source Part Number 1124869-2SB1353
Manufacturer Homepage www.rohm.com
Is this a common-used part? Yes
Popularity High
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 2SB1353 CAD Model

Description

The 2SB1353 is a PNP silicon epitaxial transistor manufactured by Rohm Semiconductor. This transistor is designed for use in power amplifier and switching applications, and it is commonly used in audio amplifiers and power supplies. The 2SB1353 is characterized by its high current capability and low saturation voltage.

Applications

  • Audio amplifiers: Used in the output stages of audio power amplifiers.
  • Switching regulators: Employed in switching power supplies.
  • DC-DC converters: Suitable for use in DC-DC converter circuits.
  • Motor drivers: Used in motor driver circuits for small to medium-sized motors.
  • General-purpose switching: Used in various general-purpose switching applications.

Features

  • PNP silicon epitaxial transistor: Utilizes PNP silicon epitaxial technology.
  • High collector current: Capable of handling high collector currents.
  • Low saturation voltage: Offers low saturation voltage for efficient switching.
  • High power dissipation: Designed for high power dissipation applications.
  • Through-hole package: Typically available in a through-hole package for easy mounting and heat dissipation.

Benefits

  • Efficient power amplification: Enables efficient power amplification in audio applications.
  • Reliable switching: Provides reliable switching performance in various applications.
  • Versatile application: Suitable for a wide range of power amplifier and switching circuits.
  • Easy to implement: Simple to integrate into circuits with minimal external components.
  • Good heat dissipation: The through-hole package facilitates effective heat dissipation.

Additional Details

When utilizing the 2SB1353, careful attention must be paid to thermal management due to its high power dissipation capability. A heat sink is generally required to maintain the junction temperature within the specified limits. The datasheet contains detailed information about the device's electrical characteristics, thermal resistance, and safe operating area. It is critical to design the base drive circuitry to ensure proper transistor operation and to avoid exceeding the maximum ratings. The device is commonly available in a TO-220 package.

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