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K4B2G1646B-HCF7

Part No K4B2G1646B-HCF7
Manufacturer Samsung
Catalog OEM Parts (J - L)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 991609-K4B2G1646B-HCF7
Categories OEM Parts(J-L)
Manufacturer Samsung
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian K4B2G1646B-HCF7 CAD Model

Description

The K4B2G1646B-HCF7 is a 2Gbit DDR3 SDRAM component manufactured by Samsung. This dynamic random-access memory is designed for high-performance applications requiring substantial memory capacity and bandwidth. The chip features a 16-bit data width and complies with the DDR3 standard, offering enhanced speed and power efficiency compared to previous DDR generations.

Applications

  • Desktop and Laptop Computers: Acts as main system memory, supporting multitasking and demanding applications.
  • Gaming Consoles: Delivers the necessary memory bandwidth for rendering high-resolution graphics and handling large game environments.
  • Networking Equipment: Employed in routers, switches, and servers to buffer and process network traffic efficiently.
  • Graphics Cards: Functions as video memory, storing textures, frame buffers, and other graphical data for rendering complex scenes.
  • Embedded Systems: Integrated into various embedded systems requiring high-speed memory, such as industrial controllers and automotive systems.

Features

  • Capacity: 2Gbit (128M x 16) memory capacity.
  • DDR3 Technology: Adheres to the DDR3 SDRAM standard for high-speed data transfer.
  • Data Width: 16-bit data width, suitable for various memory configurations.
  • Operating Speed: Supports data transfer rates up to a specified frequency (research needed for specific speed grade of HCF7).
  • Low Power Consumption: Designed to minimize power consumption, suitable for energy-efficient applications.
  • Lead-Free and RoHS Compliant: Environmentally friendly, adhering to lead-free and RoHS standards.

Benefits

  • Increased System Performance: Enables faster data access and processing, improving overall system responsiveness.
  • Enhanced Multitasking: Allows users to run multiple applications and processes concurrently without performance degradation.
  • Improved Gaming Experience: Delivers smooth and immersive gaming with high-resolution graphics and detailed environments.
  • Energy Efficiency: Reduces power consumption, leading to longer battery life in mobile devices and lower energy costs in desktop systems.
  • Reliable Operation: Provides stable and reliable memory operation, ensuring data integrity and system stability.

Additional Details

The K4B2G1646B-HCF7 operates at a specific voltage, typically 1.5V for standard DDR3. It uses a double data rate architecture to achieve high data transfer rates, effectively doubling the bandwidth compared to single data rate SDRAM. The chip is typically packaged in a FBGA (Fine-pitch Ball Grid Array) for efficient board mounting and signal integrity. Timing parameters such as CAS latency (CL), RAS to CAS delay (tRCD), and RAS precharge time (tRP) are crucial for proper memory operation and must be configured according to the manufacturer's specifications. Refer to the official Samsung datasheet for detailed specifications and timing diagrams. The HCF7 suffix likely denotes a particular speed grade and operating temperature range, which needs to be confirmed via the datasheet.

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