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K9F1G08U0C-SIB0

Part No K9F1G08U0C-SIB0
Manufacturer Samsung
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Categories Uncategorized
Manufacturer Samsung
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 826661-K9F1G08U0C-SIB0
Ultra Librarian 3D Model Ultra Librarian K9F1G08U0C-SIB0 CAD Model

Description

The K9F1G08U0C-SIB0 is a 1G-bit (128M x 8 bit) NAND Flash Memory device manufactured by Samsung. This memory device offers a combination of high density, high performance, and robust data retention, making it suitable for a variety of embedded storage applications.

Applications

  • Solid State Drives (SSDs)
  • USB Flash Drives
  • Memory Cards (SD, microSD)
  • Embedded Systems
  • Mobile Phones
  • Digital Cameras
  • MP3 Players

Features

  • High Density: 1G-bit (128M x 8 bit) capacity provides ample storage for embedded applications.
  • Page Size: (512 + 16) Bytes.
  • Block Size: (16K + 512) Bytes.
  • Fast Page Access Time: Enables quick read and write operations.
  • Supply Voltage: Operates on a 2.7V to 3.6V power supply.
  • High Reliability: Built with Samsung's advanced NAND Flash technology to ensure data integrity and longevity.
  • Data Retention: Offers long-term data retention, crucial for storage applications.
  • Command Structure: Industry-standard NAND Flash command set for ease of integration.
  • Operating Temperature: Standard operating temperature range.

Benefits

  • Increased Storage Capacity: Enables storage of large amounts of data in a small footprint.
  • Faster Performance: Reduces access times and improves overall system responsiveness.
  • Improved Reliability: Ensures data integrity and prevents data loss.
  • Reduced Power Consumption: Low power consumption extends battery life in portable devices.
  • Cost-Effective Solution: Offers a competitive price per bit compared to other memory technologies.
  • Simplified System Design: Standard interface simplifies integration into existing systems.

Additional Details

The K9F1G08U0C-SIB0 utilizes a standard NAND Flash interface, allowing for seamless integration with various microcontrollers and processors. It supports features like bad block management and wear leveling, which contribute to its overall reliability and lifespan. The specific package type is typically a TSOP (Thin Small Outline Package), which is suitable for surface mounting on PCBs. Refer to the official Samsung datasheet for detailed electrical characteristics, timing diagrams, and package dimensions.

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Pricing & Ordering

Quantity Unit Price Ext. Price
18+ $3.2282 $58.1076
44+ $2.6496 $116.5824
68+ $2.5664 $174.5152
94+ $2.4833 $233.4302
121+ $2.4012 $290.5452
161+ $2.1529 $346.6169
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 6,000 pieces
MOQ: 18 pcs
Order Increment : 1 pcs
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