The TSL0808RA-4R7M3R5-1PF is a multilayer ceramic chip inductor manufactured by TDK Corporation. It is designed for high-frequency applications requiring small size, high Q-factor, and stable inductance. This inductor is commonly used in various RF and wireless communication circuits. The compact size allows for dense placement on printed circuit boards.

Applications:

• RF filters in mobile devices.
• Impedance matching circuits for antennas.
• Wireless communication systems (e.g., Bluetooth, WLAN).
• High-frequency oscillators.
• RF chokes.

Features:

• Multilayer ceramic construction.
• Small 0808 case size.
• High Q-factor for low losses.
• Stable inductance of 4.7 μH.
• High self-resonant frequency (SRF).
• RoHS compliant.

Benefits:

• Improved signal quality due to low insertion loss.
• Reduced power consumption in RF circuits.
• Stable performance over temperature.
• Space-saving design for compact applications.
• Enhanced reliability in harsh environments.

Additional Details:

The TSL0808RA-4R7M3R5-1PF inductor features a nominal inductance value of 4.7 μH (microhenries) with a tolerance of ±20%. The 0808 case size indicates its compact dimensions, allowing for high-density mounting. The multilayer ceramic construction ensures stable performance over a wide range of temperatures and frequencies. The high Q-factor minimizes energy loss, making it suitable for RF applications. The self-resonant frequency (SRF) is typically in the high MHz to GHz range, ensuring that the inductor operates effectively at high frequencies. The rated current is approximately 50mA. The inductor is designed to withstand reflow soldering processes for automated assembly. The operating temperature range is typically from -55°C to +125°C. The 'PF' suffix denotes that the component is lead-free and RoHS compliant, meeting environmental regulations. This inductor is widely used to improve the performance of RF circuits by providing stable inductance and minimizing signal loss. Its robust design ensures reliable operation in demanding applications.