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TA8405S

Part No TA8405S
Manufacturer Toshiba Semiconductor and Storage
Catalog Electronic Wholesale
Description DUAL BRIDGE DRIVER
Sample
Rohs State Need to verify
ECAD Module
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Manufacturer Toshiba Semiconductor and Storage
Win Source Part Number 1263943-TA8405S
Manufacturer Homepage www.semicon.toshiba.co.jp/eng
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian TA8405S CAD Model

Description

The TA8405S is a monolithic integrated circuit designed for motor control applications. Specifically, it is a PWM (Pulse Width Modulation) control IC often used to drive DC motors in various appliances and automotive systems.

Applications:

  • Automotive Power Windows
  • Automotive Wiper Motors
  • Industrial Motor Control
  • Appliance Motor Control (e.g., Washing Machines, Dishwashers)

Features:

  • Built-in PWM Control Circuitry
  • Overcurrent Protection
  • Thermal Shutdown
  • Low Saturation Voltage
  • Direct Drive of Power MOSFETs

Benefits:

  • Provides precise motor speed control
  • Protects the motor and the IC from damage
  • Enhances system reliability
  • Simplifies motor control circuit design

The TA8405S integrates PWM control logic and drive circuitry in a single package. The PWM control allows for efficient and precise control of the motor speed by varying the duty cycle of the applied voltage. The overcurrent protection circuit shuts down the output if the motor current exceeds a safe level, protecting the motor and the IC from damage due to short circuits or overload conditions. The thermal shutdown feature protects the IC from overheating by disabling the output when the junction temperature reaches a critical level. The low saturation voltage of the output transistors minimizes power dissipation, improving efficiency. The TA8405S is designed to directly drive power MOSFETs, which simplifies the design of high-power motor control circuits. The specific operating voltage range and maximum output current are important parameters to consider when selecting this IC for a particular application. The device is typically packaged in a multi-lead package for efficient heat dissipation and easy mounting.

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