The TC74HC107AP is a high-speed CMOS dual JK flip-flop with clear from Toshiba's TC74HC series. This device utilizes silicon gate CMOS technology to achieve high-speed operation similar to equivalent bipolar Schottky TTL devices, while maintaining the low power consumption characteristic of CMOS integrated circuits. It provides two independent JK flip-flops in a single package, each with individual J, K, clock, and clear inputs.

Applications

• General purpose sequential logic
• Counters
• Shift registers
• Frequency dividers
• Control circuits
• Data storage

Features

• High-speed operation: fmax = 50 MHz (typ.) at VCC = 5V
• Low power dissipation: ICC = 1μA (max.) at Ta = 25°C
• High noise immunity: VNIH = VNIL = 28 % VCC (min.)
• Individual J, K, clock and clear inputs
• Positive-edge triggered clock
• Direct clear input
• Wide operating voltage range: VCC = 2V to 6V
• Pin and function compatible with 74LS107

Benefits

• Fast switching speed enabling high-frequency operation.
• Low power consumption allowing for energy-efficient designs.
• Excellent noise immunity enhances reliability in noisy environments.
• Independent flip-flops provide flexibility in circuit design.
• Direct clear input facilitates asynchronous resetting of the flip-flops.
• Wide operating voltage range accommodates various power supply configurations.

Additional Details

The TC74HC107AP comes in a DIP14 (Dual In-Line Package) and operates over a wide temperature range. Each flip-flop changes its state on the positive-going edge of the clock pulse, provided that the setup and hold time requirements are met. The J and K inputs determine the next state of the flip-flop according to the JK truth table. The direct clear input allows the flip-flop to be asynchronously reset to a low state, overriding all other inputs. The device's high noise immunity makes it suitable for applications in electrically noisy environments. The wide operating voltage range provides flexibility in various applications and power supply configurations. The low power consumption allows for dense packaging and reduces heat dissipation, making it suitable for compact devices.