The TC74LCX373FT(ELK,M) is an octal D-type transparent latch with 3-state outputs manufactured by Toshiba Semiconductor and Storage. This device is part of the LCX family of logic gates, known for their low-voltage operation and high-speed performance. It's commonly used for temporary data storage, address latching, and bus interfacing in digital systems.

Applications

• Address latching in microprocessor systems
• Data buffering
• I/O port expansion
• Memory interfacing
• Bus interfacing

Features

• Octal D-type transparent latch configuration
• 3-state outputs for bus driving applications
• Low-voltage operation (2.0V to 3.6V)
• High-speed performance (propagation delay typically around 6ns)
• Low power consumption
• TTL-compatible inputs
• Package: TSSOP20 (Thin Shrink Small Outline Package)

Benefits

• Provides temporary data storage for efficient data transfer.
• Enables bi-directional bus communication with 3-state outputs.
• Reduces power consumption in low-voltage systems.
• Provides fast data latching for high-speed applications.
• Simplifies interfacing with TTL logic devices.

Additional Details

The TC74LCX373FT(ELK,M) consists of eight D-type transparent latches, each with a 3-state output. When the latch enable (LE) input is high, the Q outputs follow the D inputs (transparent mode). When LE transitions low, the data present at the D inputs is latched and held at the Q outputs. The 3-state outputs can be in one of three states: logic high, logic low, or high impedance (disconnected). The output enable (OE) input controls the state of all eight outputs. When OE is low, the outputs are enabled. When OE is high, the outputs are in the high-impedance state, allowing multiple devices to share the same bus. The low-voltage operation of the LCX family makes it suitable for battery-powered devices. The fast propagation delay ensures minimal data skew in high-speed circuits. The ELK and M suffixes likely refer to specific tape and reel packaging options and manufacturing location. The TSSOP20 package provides a small footprint for surface mount applications.