The TC7MA244FK is an advanced high-speed CMOS octal bus buffer with 3-state outputs manufactured by Toshiba Semiconductor and Storage. It is designed for high-performance memory and data bus applications requiring minimal propagation delay and high drive capability. The device provides eight non-inverting buffers with individual output enable controls, allowing for flexible data routing and isolation.

Applications

• Memory Interfacing
• Data Bus Buffering
• Address Line Driving
• High-Speed Logic Systems
• Microprocessor Systems

Features

• Octal Bus Buffer
• Non-Inverting Outputs
• 3-State Outputs
• Individual Output Enables
• High-Speed Operation
• Low Power Consumption
• Wide Operating Voltage Range

Benefits

• Improved System Performance: High-speed operation minimizes propagation delay, resulting in faster data transfer rates and improved overall system performance.
• Flexible Data Routing: Individual output enable controls allow for flexible data routing and isolation, enabling complex data bus configurations.
• Reduced Power Consumption: Low power consumption minimizes heat dissipation and extends battery life in portable applications.
• Increased System Reliability: 3-state outputs prevent bus contention and improve system reliability.
• Easy Integration: Wide operating voltage range and standard pinout simplify integration into existing systems.

Technical Specifications

• Number of Channels: 8
• Output Type: Non-Inverting, 3-State
• Propagation Delay: 3.5 ns (typical)
• Supply Voltage Range: 2.0V to 5.5V
• Output Drive Capability: ±24 mA
• Operating Temperature Range: -40°C to +85°C
• Package: TSSOP20

The TC7MA244FK is an essential component for high-performance digital systems requiring reliable data buffering and routing. Its octal configuration, 3-state outputs, and individual enable controls provide the flexibility and performance needed for demanding applications. The high-speed operation and low power consumption make it suitable for both high-end computing and portable devices. The TSSOP20 package provides a compact footprint for space-constrained designs.