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TLP9104A(AST

Part No TLP9104A(AST
Manufacturer Toshiba Semiconductor and Storage
Catalog Optoisolators - Logic Output
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 1320+
Reference case SOP5
Manufacturer Toshiba Semiconductor and Storage
Manufacturer Homepage www.semicon.toshiba.co.jp/eng
Win Source Part Number 757539-TLP9104A(AST
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian TLP9104A(AST CAD Model

Description

The TLP9104A(AST is a high-speed photocoupler manufactured by Toshiba Semiconductor and Storage. It features a GaAlAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC. This photocoupler is designed for high-speed digital interface applications requiring electrical isolation.

Applications

  • High-speed digital interfaces
  • Programmable logic controllers (PLCs)
  • Inverter control
  • Switching power supplies
  • Communication equipment

Features

  • High-speed operation: 10 Mbps (typ.)
  • High common-mode transient immunity: ±20 kV/μs (min.)
  • Guaranteed performance from −40°C to 100°C
  • Low input current: IF = 5 mA (max.)
  • Supply voltage: 2.7 V to 5.5 V
  • Safety standards: UL recognized: UL1577, CSA approved: CSA Component Acceptance Service No. 5A, VDE approved: EN60747-5-5 (Option)

Benefits

  • Provides electrical isolation between input and output circuits
  • Ensures reliable data transmission in noisy environments
  • High-speed operation supports demanding digital interfaces
  • Wide operating temperature range for use in various environments
  • Low input current reduces power consumption
  • Meets stringent safety standards

Additional Details

The TLP9104A(AST features a high common-mode transient immunity, which prevents spurious signals from being transmitted across the isolation barrier. The device is designed to operate over a wide temperature range. It is available in a SO6 package and certified by UL, CSA and VDE, guaranteeing its safety and reliability in demanding applications.

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