• The solder profile must comply with the technical product specifications. All other profiles will void the warranty. • To avoid contact finger misplacement and to avoid the soldering joints coming off, use maximum adjusted force at the Pick- and Place machine that does not exceed the recommended compression rate (of the contact fingers). • The soldering joints must be kept clean, dry and grease free. The contact fingers should be placed onto the solder pad of the printed circuit board in a way that no tin solder is able to come into the undermost or the first elastic bending of the contact fingers. This will avoid the bending being affected. • All other soldering methods are at the customers’ own risk.