The XC7K325T-3FFG900I is a Kintex-7 FPGA from Xilinx. This FPGA family is designed for high-performance, power-optimized applications in a variety of industries. The Kintex-7 family balances performance, power consumption, and cost, making it a versatile choice for a wide range of applications.

Applications

• High-speed data acquisition
• Image and video processing
• Networking and telecommunications
• Aerospace and defense
• Industrial automation

Features

• 326,080 logic cells
• 16020 Kbits of Block RAM
• 740 DSP slices
• 360 general purpose I/Os
• Integrated PCIe Gen3
• 900-pin Fine-Pitch Ball Grid Array (FBGA) package

Benefits

• High performance with low power consumption
• Flexible and scalable architecture
• Reduced development time with comprehensive tool support
• Improved system reliability
• Cost-effective solution for a wide range of applications

Technical Specifications

The XC7K325T-3FFG900I operates with a core voltage of 0.9V. It supports a wide range of I/O standards, including DDR3, DDR2, and LVDS. The device is available in a 900-pin FBGA package with a -3 speed grade and an industrial temperature range (-40°C to +100°C). The Kintex-7 family is supported by the Xilinx Vivado Design Suite, which provides a comprehensive environment for design entry, simulation, and implementation. The device is also equipped with advanced security features, including bitstream encryption and authentication.

The 740 DSP slices enable high-performance digital signal processing. The integrated PCIe Gen3 interface facilitates high-speed data transfer. The 360 general-purpose I/Os provide flexible connectivity to external devices. The large amount of Block RAM allows for on-chip storage of data and instructions.