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Same model may have multiple batches, images only for reference.
HSB12-272706 Real Image
Same model may have multiple batches, images only for reference.

HSB12-272706

Part No HSB12-272706
Manufacturer CUI Inc.
Catalog Thermal - Heat Sinks
Description HEAT SINK, BGA, 27 X 27 X 6 MM  /  Heat Sink BGA Aluminum Alloy 3.8W @ 75°C Top Mount
Datasheet
HSB12-272706 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Fans, Thermal Management>Thermal - Heat Sinks
Mfr CUI Devices
Series HSB
Package Box
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 1.063" (27.00mm)
Width 1.063" (27.00mm)
Fin Height 0.236" (6.00mm)
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow 7.80°C/W @ 200 LFM
Thermal Resistance @ Natural 19.59°C/W
Material Aluminum Alloy
Material Finish Black Anodized
MSL Level Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8473.30.5100
Other Names 2223-HSB12-272706
Standard Package 1,540
Win Source Part Number 1147486-HSB12-272706
Ultra Librarian 3D Model Ultra Librarian HSB12-272706 CAD Model

Description

The CUI Devices HSB12-272706 is a top mount heat sink made of aluminum alloy manufactured by CUI Devices.

  • Package: BGA
  • Shape: Square
  • Fin Type: Pin Fins
  • Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 19.59°C/W
  • Power Dissipation @ Temperature Rise: 3.8W @ 75°C
  • Win Source Part Number: 1147486-HSB12-272706

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