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XPC7455RX600LC

Part No XPC7455RX600LC
Manufacturer Freescale Semiconductor - NXP
Catalog OEM Parts (T - Z)
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ECAD Module
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Win Source Part Number 993680-XPC7455RX600LC
Categories OEM Parts(T-Z)
Manufacturer Freescale Semiconductor - NXP
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XPC7455RX600LC CAD Model

Description

The XPC7455RX600LC is a high-performance PowerPC microprocessor from Freescale (now NXP). It is designed for embedded applications requiring significant processing power and is part of the PowerPC 74xx family.

Applications:

  • Networking equipment such as routers and switches.
  • Telecommunications infrastructure.
  • Industrial control systems.
  • High-end printers and imaging devices.
  • Aerospace and defense applications.

Features:

  • 600 MHz clock speed.
  • PowerPC architecture with AltiVec technology for enhanced vector processing.
  • Integrated 512 KB L2 cache.
  • 1.8V core voltage.
  • 1.5V I/O voltage.
  • 360-pin ball grid array (BGA) package.
  • On-chip memory controller supporting DDR SDRAM.
  • Enhanced floating-point unit for improved performance in scientific and engineering applications.

Benefits:

  • High processing performance for demanding applications.
  • AltiVec technology accelerates multimedia and signal processing tasks.
  • Integrated L2 cache reduces memory latency and improves overall system performance.
  • Low power consumption compared to other high-performance processors.
  • Robust design suitable for harsh environments.

Additional Details:

The XPC7455RX600LC is typically used in systems requiring real-time processing and high reliability. The integrated memory controller supports various memory configurations, allowing for flexible system design. The AltiVec instruction set provides a significant performance boost for applications involving vector operations, such as image processing, audio processing, and scientific simulations.

Freescale Semiconductor (now NXP) designed this processor to balance performance and power consumption, making it suitable for a wide range of embedded applications. The processor is known for its stability and long-term availability, making it a popular choice for industrial and aerospace applications.

The part is packaged in a 360-pin BGA, enabling high-density board designs. It supports a variety of interfaces, allowing for seamless integration with other system components. Its advanced power management features help to reduce overall system power consumption and extend battery life in portable applications.

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