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H5TQ2G63DFR-RDI

Part No H5TQ2G63DFR-RDI
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1866 128Mx16 FBGA (2Gb) Ind
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941132-H5TQ2G63DFR-RDI
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ2G63DFR-RDI CAD Model

Description

The Hynix H5TQ2G63DFR-RDI is a high-performance Double Data Rate 3 (DDR3) SDRAM (Synchronous Dynamic Random-Access Memory) component. It is designed for use in a variety of applications requiring high bandwidth and low latency memory solutions. This particular part number indicates a specific configuration and speed grade within the H5TQ2G63DFR series.

Applications

  • Desktop and Laptop Computers: Used as main system memory to enable fast data access and multitasking.
  • Servers: Employed in server systems to support demanding workloads and high transaction rates.
  • Graphics Cards: Integrated into graphics cards to provide fast memory for processing textures and rendering images.
  • Gaming Consoles: Used as the main memory or graphics memory in gaming consoles for smooth gameplay and high-resolution graphics.
  • Networking Equipment: Found in routers, switches, and other networking devices to buffer and process network traffic efficiently.
  • Embedded Systems: Utilized in embedded systems requiring high-performance memory, such as industrial control systems and digital signage.

Features

  • DDR3 Technology: Leverages DDR3 architecture for improved data transfer rates and lower power consumption compared to previous generations.
  • 2Gb Density: Offers a memory density of 2 Gigabits, providing ample space for storing data and instructions.
  • High Bandwidth: Delivers high bandwidth to facilitate rapid data access and processing.
  • Low Power Consumption: Operates at a low voltage, reducing power consumption and heat generation.
  • RoHS Compliant: Manufactured in compliance with RoHS standards, ensuring environmental friendliness.
  • FBGA Package: Utilizes a Fine-Pitch Ball Grid Array (FBGA) package for improved signal integrity and thermal performance.

Benefits

  • Increased System Performance: Enables faster data access and processing, resulting in improved overall system performance.
  • Enhanced Multitasking: Allows for smooth multitasking by providing sufficient memory capacity for multiple applications.
  • Improved Graphics Performance: Enhances graphics performance by providing fast memory for processing textures and rendering images.
  • Reduced Power Consumption: Low power consumption translates to longer battery life in portable devices and lower energy costs in desktop and server systems.
  • Increased System Stability: Stable and reliable memory operation ensures system stability and prevents data corruption.

Additional Details

The H5TQ2G63DFR-RDI typically operates at a voltage of 1.5V. It features a data transfer rate of up to 1600 MT/s (MegaTransfers per second), depending on the specific configuration and speed grade. The operating temperature range is usually between 0°C and 85°C. The exact timings (CL, tRCD, tRP) vary depending on the speed grade and are typically specified in the product datasheet.

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