The GCM21BR11H223KA21L is a Murata Electronics multilayer ceramic capacitor (MLCC). It is designed for high-frequency applications and general-purpose usage where a stable and reliable capacitor is needed.

Applications

• High-Frequency Circuits: Used in RF amplifiers, oscillators, and other high-frequency circuits.
• Decoupling: Provides decoupling for IC power supplies, reducing noise and voltage fluctuations.
• Bypass: Bypasses high-frequency noise to ground, improving signal integrity.
• Filtering: Used in filtering circuits to attenuate unwanted frequencies.
• Mobile Communication Devices: Found in smartphones, tablets, and wireless modules.
• Networking Equipment: Used in routers, switches, and other networking devices.

Features

• Capacitance: 22nF (22 nanofarads or 0.022µF)
• Voltage Rating: 50V (Volts)
• Temperature Coefficient: R (EIA Class II), indicating good stability.
• Tolerance: ±10%
• Case Size: 0805 (2012 Metric)
• Termination: Nickel Barrier with Tin Plating for excellent solderability.
• High Reliability: Designed for stable performance and long lifespan.
• RoHS Compliant: Complies with Restriction of Hazardous Substances directives.

Benefits

• Stable Performance: Provides stable capacitance over a wide range of temperatures and voltages.
• Effective Decoupling: Reduces noise and voltage fluctuations in power supplies.
• Space Saving: 0805 case size offers a good balance between size and performance.
• Reliable Soldering: Nickel barrier termination ensures reliable solder joints.
• High-Frequency Performance: Suitable for use in high-frequency circuits.

Additional Details

This MLCC capacitor uses a ceramic dielectric material to achieve its capacitance. The temperature coefficient indicates its capacitance change characteristics with temperature variation. The nickel barrier termination prevents silver migration, which can cause failures in high-humidity environments. This component is suitable for reflow soldering processes. The 0805 package provides a larger footprint than smaller case sizes, offering easier handling and soldering during assembly.