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K4B2G1646F-BCMA000

Part No K4B2G1646F-BCMA000
Manufacturer Samsung
Description DRAM Chip DDR3 SDRAM 2G-Bit 128M x 16 1.5V 96-Pin F-BGA
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RoHS Non-Compliant
Win Source Part Number 1224913-K4B2G1646F-BCMA000
Categories Custom Parts
Manufacturer Samsung
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian K4B2G1646F-BCMA000 CAD Model

Description

The K4B2G1646F-BCMA000 is a 2Gb DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) chip manufactured by Samsung. This memory component is widely used in various electronic devices requiring high-speed data access and storage, such as computers, laptops, gaming consoles, and networking equipment.

Applications

  • Desktop and laptop computers
  • Gaming consoles (e.g., PlayStation, Xbox)
  • Networking equipment (e.g., routers, switches)
  • Graphics cards
  • Embedded systems requiring high-speed memory

Features

  • 2Gb Capacity: Provides a substantial amount of memory for data storage.
  • DDR3 Technology: Enables high-speed data transfer rates.
  • 16-bit Data Width: Allows for parallel data access.
  • 8 Banks: Organizes memory into multiple banks for efficient access.
  • Operating Frequency: Supports various operating frequencies depending on the specific configuration.
  • FBGA Package: Uses a fine-pitch ball grid array package for surface mounting.

Benefits

  • High Performance: DDR3 technology offers faster data transfer rates compared to previous generations.
  • Large Capacity: 2Gb capacity allows for storing large amounts of data.
  • Efficient Data Access: Multiple banks enable efficient data access and reduce latency.
  • Reduced Power Consumption: DDR3 technology offers improved power efficiency compared to DDR2.
  • Improved System Responsiveness: High-speed data access contributes to overall system responsiveness.
  • Wide Availability: DDR3 memory is widely available and supported by various platforms.

Additional Details

The K4B2G1646F-BCMA000 is typically used in memory modules (DIMMs or SODIMMs) that are plugged into the motherboard of a computer or other electronic device. The specific operating frequency and timings depend on the JEDEC standard and the module manufacturer's specifications. The FBGA package provides excellent thermal performance and allows for high-density mounting. The chip requires a 1.5V power supply and operates within a specified temperature range. This particular part is very common in PCs and laptops produced from 2010 to 2015.

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Pricing & Ordering

Quantity Unit Price Ext. Price
18+ $2.9105 $52.3890
42+ $2.3881 $100.3002
65+ $2.3135 $150.3775
90+ $2.2389 $201.5010
116+ $2.1642 $251.0472
155+ $1.9403 $300.7465
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 18 pieces
MOQ: 18 pcs
Order Increment : 1 pcs
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