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APA4401040001-ECUO-.MG

Part No APA4401040001-ECUO-.MG
Manufacturer Samtec Inc.
Catalog OEM Parts (A - B)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1045559-APA4401040001-ECUO-.MG
Categories OEM Parts(A-B)
Manufacturer Samtec Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian APA4401040001-ECUO-.MG CAD Model

Description

The APA4401040001-ECUO-.MG is a component manufactured by Samtec Inc. falling under the category of OEM parts. While specific details require deeper investigation, Samtec is known for producing high-quality connectors and interconnect solutions. This part is likely a connector or related interconnect component, designed for specific applications needing reliable and high-performance connectivity.

Applications:

  • Board-to-Board Connections
  • Cable-to-Board Connections
  • High-Speed Data Transfer
  • Telecommunications Equipment
  • Medical Devices

Features:

  • High Density Packaging
  • High-Speed Data Transmission
  • Robust Mechanical Design
  • Multiple Pin Configurations
  • Surface Mount Technology (SMT)

Benefits:

  • Reliable Connection
  • Efficient Data Transfer
  • Compact Design
  • Easy Integration
  • Long-Term Durability

Additional Details:

Given Samtec's expertise, the APA4401040001-ECUO-.MG likely features gold-plated contacts to ensure optimal conductivity and resistance to corrosion, which is critical for maintaining signal integrity over time. It is likely designed to meet stringent industry standards for electrical and mechanical performance. The housing material is typically made from high-temperature thermoplastic, allowing it to withstand reflow soldering processes without deformation. Depending on the configuration, it might support data rates up to several Gbps. Its compact design allows for efficient use of board space, which is essential in high-density applications. The robust mechanical design ensures secure mating and unmating cycles, making it reliable for long-term use. This component is engineered to provide a reliable and efficient connection in a variety of electronic systems, enabling high-performance data transfer and robust mechanical stability.

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