The S29GL256P90TFIR20D is a 256 Mbit (32 Mbyte) NOR flash memory device manufactured by Spansion (now Cypress Semiconductor, and subsequently Infineon Technologies). It is designed for high-performance, high-density memory applications requiring fast read access and reliable data storage. This device operates at 3.0V and is commonly used in embedded systems for code storage and execution.
Applications
- Embedded systems for storing boot code and application code
- Networking equipment such as routers and switches
- Automotive electronics for storing firmware and configuration data
- Industrial control systems
- Consumer electronics devices requiring non-volatile memory
Features
- 256 Mbit (32 Mbyte) memory density
- NOR flash technology for fast random access
- 3.0V single power supply operation
- Sector Erase Architecture
- x8 and x16 data bus configurations
- Operating temperature range of -40°C to +85°C
- Common Flash Interface (CFI) for device identification and parameter information
- Advanced Sector Protection (ASP) features
- Program Suspend/Resume capabilities
Benefits
- High density allows for the storage of large amounts of code and data.
- Fast read access times enable quick boot-up and execution of applications.
- Low voltage operation reduces power consumption, making it suitable for battery-powered devices.
- Sector erase architecture enables efficient memory management.
- Reliable data storage ensures data integrity and prevents data loss.
- The industrial temperature range ensures reliable operation in harsh environments.
Additional Details
The S29GL256P90TFIR20D utilizes a NOR flash memory array, which provides fast random access capabilities. The device supports both x8 and x16 data bus configurations, offering flexibility in system design. It also incorporates sector protection features to prevent accidental erasure or programming of critical data. This part is often used in applications that require Execute-In-Place (XIP) functionality where code is executed directly from the flash memory without being copied to RAM.
Package type is typically a TSOP (Thin Small Outline Package).