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2SK2610(F)

Part No 2SK2610(F)
Manufacturer Toshiba Semiconductor and Storage
Catalog Transistors - FETs, MOSFETs - RF
Description Trans MOSFET N-CH Si 900V 5A 3-Pin(3+Tab) TO-3PN
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Continuous Drain Current (ID) 5 A
Drain to Source Voltage (Vdss) 900 V
Dual Supply Voltage 900 V
Gate to Source Voltage (Vgs) 30 V
Lead Free Yes
Lead Pitch 5.45 mm
Maximum Operating Temperature 150 °C
Max Power Dissipation 150 W
Min Operating Temperature -55 °C
Mount Through Hole
Nominal Vgs 4 V
Number of Elements 1
Number of Pins 3
Power Dissipation 150 W
RoHS Compliant
Termination Through Hole
Win Source Part Number 1037714-2SK2610(F)
Categories Transistors - FETs, MOSFETs - RF
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian 2SK2610(F) CAD Model

Description

The 2SK2610(F) is an N-channel power MOSFET manufactured by Toshiba Semiconductor and Storage. It is designed for high-speed switching applications, particularly in power supplies, DC-DC converters, and motor control circuits. The (F) designation typically indicates a specific package or manufacturing variation.

Applications

  • Power Supplies: Used as a switching element in switched-mode power supplies (SMPS) to efficiently convert voltage levels.
  • DC-DC Converters: Employed in DC-DC converters to regulate voltage levels in electronic devices.
  • Motor Control: Utilized in motor control circuits to control the speed and torque of electric motors.
  • Inverters: Applied in inverter circuits to convert DC power to AC power.
  • Lighting Systems: Integrated into electronic ballasts for fluorescent lamps and LED drivers.

Features

  • N-Channel MOSFET: Offers efficient switching and low on-resistance.
  • High-Speed Switching: Designed for fast switching speeds, reducing switching losses in power conversion applications.
  • Low On-Resistance (RDS(on)): Minimizes power dissipation and improves efficiency.
  • High Avalanche Capability: Provides robustness against voltage spikes and inductive loads.
  • (F) Package: Specifies a particular package type, which may offer improved thermal performance or other benefits.

Benefits

  • Improved Power Efficiency: The low on-resistance and high-speed switching reduce power losses in power conversion systems.
  • Reduced Heat Dissipation: Minimizes heat generation, enhancing the reliability and lifespan of electronic devices.
  • Enhanced System Performance: Provides stable and efficient power delivery to various electronic components.
  • Robust Design: The high avalanche capability protects against voltage transients and inductive kickback.
  • Compact Solution: The package design allows for integration into space-constrained applications.

Additional Details

The 2SK2610(F) MOSFET has specific ratings for drain-source voltage (VDS), gate-source voltage (VGS), and continuous drain current (ID). It is crucial to operate within these limits to ensure proper operation and prevent damage. The gate threshold voltage (VGS(th)) is a critical parameter for determining the switching characteristics of the MOSFET. The total gate charge (Qg) and output capacitance (Coss) affect the switching speed and efficiency of the device. This MOSFET is often used in applications where minimizing power consumption and maximizing efficiency are paramount. Refer to the datasheet for detailed electrical characteristics, thermal resistance, and recommended operating conditions.

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