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SSM6N44FELR3F

Part No SSM6N44FELR3F
Manufacturer Toshiba Semiconductor and Storage
Catalog Hard To Find
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 1449+
Reference case SOT563
Manufacturer Toshiba Semiconductor and Storage
Manufacturer Homepage www.semicon.toshiba.co.jp/eng
Win Source Part Number 712320-SSM6N44FELR3F
Popularity Low
Supply and Demand Status Sufficient
Ultra Librarian 3D Model Ultra Librarian SSM6N44FELR3F CAD Model

Description

The SSM6N44FELR3F is a dual N-channel MOSFET from Toshiba Semiconductor and Storage. It's designed for a variety of switching applications, offering low on-resistance and high-speed switching in a compact package. This device is often employed in load switching, DC-DC conversion, and power management circuits for portable and embedded systems.

Applications

  • Load switches
  • DC-DC converters
  • Power management circuits
  • Motor control
  • Backlight inverters
  • LED drivers
  • Portable devices

Features

  • Dual N-channel MOSFETs in a single package
  • Low on-resistance (RDS(on))
  • High-speed switching
  • Low threshold voltage (Vth)
  • Small surface mount package (ES6)
  • Lead-free terminal plating
  • RoHS compliant

Benefits

  • Reduced component count and board space
  • Efficient switching performance
  • Easily driven by low voltage logic
  • Simplified circuit design
  • Environmentally friendly
  • Improved thermal performance

Additional Details

The SSM6N44FELR3F's dual MOSFET configuration allows for flexibility in circuit design, enabling it to be used in a variety of topologies. The low on-resistance minimizes power losses, contributing to higher efficiency in switching applications. The low threshold voltage makes it compatible with low-voltage logic control signals. The small surface mount package is ideal for space-constrained applications. It's crucial to refer to the datasheet for detailed specifications such as drain-source voltage, gate-source voltage, drain current, and power dissipation to ensure proper operation and avoid device damage. Proper thermal management techniques, such as using appropriate PCB layout and heat sinking, should be employed to maximize device reliability.

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