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W651GG2JB-05

Part No W651GG2JB-05
Manufacturer Winbond Electronics
Catalog Electronic Wholesale
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ECAD Module
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Reference Date Code 10+
Reference case BGA
Manufacturer Winbond Electronics
Manufacturer Homepage www.winbond.com
Win Source Part Number 750654-W651GG2JB-05
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian W651GG2JB-05 CAD Model

Description

The W651GG2JB-05 is a high-speed DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Winbond Electronics. It's designed for applications requiring fast data access and transfer rates, such as graphics cards, high-performance computing, and embedded systems.

Applications

  • Graphics cards
  • High-performance computing (HPC) systems
  • Embedded systems
  • Networking equipment
  • Gaming consoles
  • Industrial automation systems

Features

  • DDR3 technology for high bandwidth and low power consumption
  • Density: Typically a 1Gb or 2Gb chip (needs confirmation based on the specific datasheet)
  • Data Rate: Up to 2000 Mbps (Based on -05 speed grade, indicating 500MHz clock speed resulting in 1000MHz DDR or 2000MT/s data rate)
  • Voltage: 1.5V standard DDR3 voltage
  • Interface: Standard DDR3 interface
  • Operating Temperature Range: Commercial temperature range

Benefits

  • High Bandwidth: Enables fast data transfer rates for demanding applications.
  • Low Power Consumption: Reduces overall system power consumption compared to older memory technologies.
  • Improved System Performance: Speeds up application loading times and enhances overall system responsiveness.
  • Cost-Effective: Provides a good balance between performance and cost.
  • Wide Availability: DDR3 is a widely adopted memory standard with readily available components.

Additional Details

The W651GG2JB-05 is usually packaged in a FBGA (Fine-Pitch Ball Grid Array) package for surface mount assembly. It adheres to the JEDEC standards for DDR3 SDRAM. Proper decoupling capacitors are required for stable operation. Timing parameters need to be configured correctly in the memory controller to ensure optimal performance and stability. Signal integrity is crucial at high data rates, so careful PCB layout is necessary. The exact organization (e.g., 64M x 16, 128M x 8) and other specific details can be confirmed by reviewing the product datasheet from Winbond.

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Pricing & Ordering

Quantity Unit Price Ext. Price
9+ $5.8209 $52.3881
21+ $4.7762 $100.3002
33+ $4.6269 $152.6877
45+ $4.4777 $201.4965
58+ $4.3284 $251.0472
78+ $3.8806 $302.6868
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 330 pieces
MOQ: 9 pcs
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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