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XCZU15EG-L2FFVC900E

Part No XCZU15EG-L2FFVC900E
Manufacturer Xilinx Inc.
Catalog OEM Souring
Description FPGA
Sample
Rohs State rohs
ECAD Module
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Category OEM Souring
Win Source Part Number 1463392-XCZU15EG-L2FFVC900E
Manufacturer Xilinx Inc.
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Ultra Librarian 3D Model Ultra Librarian XCZU15EG-L2FFVC900E CAD Model

Description

The XCZU15EG-L2FFVC900E is part of the Zynq UltraScale+ MPSoC family, a revolutionary line of products from Xilinx that combines a high-performance ARM-based multicore, multiprocessor system on chip (MPSoC) with Xilinx’s FPGA technology. This component is encapsulated in a 900-pin BGA package and is designed for extensive data processing and high-speed connectivity in applications such as 5G wireless communication, automotive advanced driver assistance systems (ADAS), and industrial Internet of Things (IoT). It integrates a quad-core ARM Cortex-A53 processing system with a dual-core ARM Cortex-R5 real-time processing unit and a Mali-400MP2 graphics processing unit (GPU), providing a comprehensive solution for both application processing and customizable hardware acceleration. The XCZU15EG-L2FFVC900E emphasizes performance, versatility, and power efficiency, making it suitable for developers looking to integrate a wide range of functions into a single device while maintaining low power consumption and high data throughput.

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