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Same model may have multiple batches, images only for reference.
ATS-55150W-C0-R0
Same model may have multiple batches, images only for reference.

ATS-55150W-C0-R0

Part No ATS-55150W-C0-R0
Manufacturer Advanced Thermal Solutions Inc.
Catalog Thermal - Heat Sinks
Description HEATSINK 15X15X24.5MM W/OUT TIM / Heat Sink BGA Aluminum Top Mount
Sample
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Category Fans, Thermal Management - Thermal - Heat Sinks
Mfr Advanced Thermal Solutions Inc.
Package Bulk
Type Top Mount
Package Cooled BGA
Attachment Method Thermal Tape, Adhesive (Not Included)
Shape Square, Fins
Length 0.591" (15.00mm)
Width 0.591" (15.00mm)
Fin Height 0.965" (24.50mm)
Thermal Resistance @ Forced Air Flow 11.70°C/W @ 200 LFM
Material Aluminum
Material Finish Black Anodized
Base Product Number ATS-551
Standard Package 10
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8473.30.5100
Win Source Part Number 1339162-ATS-55150W-C0-R0
Ultra Librarian 3D Model Ultra Librarian ATS-55150W-C0-R0 CAD Model

Description

The ATS-55150W-C0-R0 is a top mount heat sink designed to cool a ball grid array (BGA) package and is manufactured by Advanced Thermal Solutions Inc..

  • Material: Aluminum
  • Shape: Square with fins
  • Length: 0.591 inches (15 mm)
  • Width: 0.591 inches (15 mm)
  • Fin Height: 0.965 inches (24.5 mm)
  • Thermal Resistance: 11.70°C/W @ 200 LFM
  • Attachment Method: Thermal tape or adhesive

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