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Same model may have multiple batches, images only for reference.
ATS-53250D-C1-R0 Real Image
Same model may have multiple batches, images only for reference.

ATS-53250D-C1-R0

Part No ATS-53250D-C1-R0
Manufacturer Advanced Thermal Solutions Inc.
Catalog Thermal - Heat Sinks
Description HEAT SINK 25MM X 25MM X 9.5MM / Heat Sink BGA Aluminum Top Mount
Sample
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ECAD Module
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Products specifications Report Issue?

Category Fans, Thermal Management>Thermal - Heat Sinks
Mfr Advanced Thermal Solutions Inc.
Series maxiGRIP
Package Bulk
Type Top Mount
Package Cooled BGA
Attachment Method Clip, Thermal Material
Shape Square, Fins
Length 0.984" (25.00mm)
Width 0.984" (25.00mm)
Fin Height 0.374" (9.50mm)
Thermal Resistance @ Forced Air Flow 15.30°C/W @ 200 LFM
Material Aluminum
Material Finish Black Anodized
Base Product Number ATS-532
MSL Level Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8473.30.5100
Other Names ATS53250DC2R0,ATS-53250D-C2-R0,ATS1151
Standard Package 100
Win Source Part Number 975602-ATS-53250D-C1-R0
Ultra Librarian 3D Model Ultra Librarian ATS-53250D-C1-R0 CAD Model

Description

The Advanced Thermal Solutions Inc. maxiGRIP ATS-53250D-C1-R0 is a top mount heat sink for BGA package cooling.

  • Shape: square, fins
  • Material: aluminum
  • Package: bulk
  • Length and Width: 0.984 inches (25.00mm)
  • Thermal Resistance: 15.30°C/W @ 200 LFM
  • Finish: black anodized
  • REACH: unaffected
  • HTSUS Code: 8473.30.5100
  • Recommendation: effective BGA package cooling

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