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Same model may have multiple batches, images only for reference.
BDN10-3CB/A01
Same model may have multiple batches, images only for reference.

BDN10-3CB/A01

Part No BDN10-3CB/A01
Manufacturer CTS Thermal Management Products
Catalog Thermal - Heat Sinks
Description HEATSINK CPU W/ADHESIVE 1.01"SQ
Datasheet
BDN10-3CB/A01 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Fans, Thermal Management - Thermal - Heat Sinks
Mfr CTS Thermal Management Products
Series BDN
Package Box
Product Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 1.010" (25.65mm)
Width 1.010" (25.65mm)
Diameter -
Fin Height 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural 26.40°C/W
Material Aluminum
Material Finish Black Anodized
Shelf Life 24 Months
Base Product Number BDN10
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8473.30.5100
Win Source Part Number 1375919-BDN10-3CB/A01
Ultra Librarian 3D Model Ultra Librarian BDN10-3CB/A01 CAD Model

Description

The BDN10-3CB/A01 is a top mount heat sink manufactured by CTS Thermal Management Products.

  • Series: BDN
  • Packaging: Box
  • Material: Aluminum
  • Shape: Square with Pin Fins
  • Length: 1.010" (25.65mm)
  • Fin Height: 0.355" (9.02mm)
  • Package Compatibility: BGA, LGA, CPU, ASIC
  • Attachment: Thermal Tape or Adhesive

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