The FDD5N60NZ is a 600V N-Channel MOSFET from Fairchild Semiconductor (now ON Semiconductor). It is part of the SupreMOS® MOSFET family, designed to offer superior switching performance and higher avalanche energy, making it suitable for demanding power applications.

Applications

• Switch Mode Power Supplies (SMPS)
• Power Factor Correction (PFC)
• Lighting Ballasts
• DC-DC Converters
• Motor Control
• Solar Inverters

Features

• High Voltage Rating: 600V drain-source voltage capability.
• Low On-Resistance: Reduces conduction losses, improving efficiency.
• Low Gate Charge: Minimizes switching losses, improving efficiency at high frequencies.
• High Avalanche Energy: Robust performance under avalanche conditions.
• SupreMOS® Technology: Fairchild's advanced MOSFET technology for superior performance.
• RoHS Compliant: Environmentally friendly and compliant with regulations.

Benefits

• Increased Efficiency: Lower on-resistance and switching losses contribute to higher overall efficiency in power conversion applications.
• Improved Reliability: High avalanche energy ensures robust operation under voltage stress.
• Reduced Heat Dissipation: Lower power losses result in less heat generation, simplifying thermal management.
• Simplified Design: Easier to implement in power supply designs due to its predictable characteristics.
• Compliance: RoHS compliance ensures adherence to environmental regulations.

Additional Details

The FDD5N60NZ has a drain-source voltage (VDS) of 600V and a continuous drain current (ID) of 5A (at Tc = 25°C). It features a low typical on-resistance (RDS(on)), contributing to its high efficiency. The device is typically supplied in a D-PAK (TO-252) package. The gate threshold voltage (VGS(th)) is typically around 3V. The SupreMOS® technology enables a smaller die size with improved performance characteristics. The device's fast switching speed and low gate charge (Qg) contribute to reduced switching losses. This MOSFET is well-suited for applications requiring high voltage operation, high efficiency, and robustness. The D-PAK package is a surface mount package suitable for automated assembly. The device is designed to operate over a wide temperature range. It is designed for high dv/dt capability. It can withstand repetitive avalanche events.