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2SK2926L

Part No 2SK2926L
Manufacturer Hitachi, Ltd
Catalog Hard To Find
Description Silicon N Channel MOS FET High Speed Power Switching
Sample
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ECAD Module
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Manufacturer Hitachi, Ltd
Win Source Part Number 1127424-2SK2926L
Manufacturer Homepage www.renesas.com/eng
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian 2SK2926L CAD Model

Description

The 2SK2926L is an N-channel MOSFET transistor manufactured by Hitachi. It's designed for high-speed switching applications and power amplification. Due to its N-channel configuration, it allows current flow when a positive voltage is applied to the gate terminal.

Applications

  • Switching regulators
  • DC-DC converters
  • Motor control circuits
  • Power amplifiers
  • High-speed switching circuits

Features

  • N-channel MOSFET
  • High-speed switching
  • Low on-resistance (RDS(on))
  • High drain current (ID) capability
  • Low gate charge (Qg)
  • Avalanche rated

Benefits

  • Efficient power conversion: Low on-resistance minimizes power losses during switching, resulting in higher efficiency in power conversion applications.
  • Fast switching speeds: Enables the device to be used in high-frequency switching applications.
  • Reduced heat generation: Lower RDS(on) contributes to reduced heat generation, enhancing reliability and thermal management.
  • Improved system performance: High drain current capability allows the device to handle large loads and improve system performance.
  • Enhanced reliability: Avalanche rating provides robustness against voltage transients, increasing the overall reliability of the application.

Additional Details

The 2SK2926L is characterized by its low on-resistance, which reduces power dissipation and improves efficiency. Its high drain current capability makes it suitable for driving demanding loads. The avalanche rating indicates its ability to withstand voltage transients without damage. It's essential to consult the Hitachi datasheet for detailed electrical characteristics, thermal resistance, and safe operating area to ensure proper application and prevent device failure. Consider proper heat sinking techniques for applications involving high power dissipation. Due to the age of the device, sourcing may be limited, and newer alternatives might offer superior performance.

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