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CY91248SZPFV-GS-553E1

Part No CY91248SZPFV-GS-553E1
Manufacturer Infineon Technologies
Catalog Embedded - Microcontrollers
Description IC MCU FLASH LQFP / - Microcontroller IC
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Category Integrated Circuits (ICs) - Embedded - Microcontrollers
Mfr Infineon Technologies
Package Tray
Product Status Obsolete
Base Product Number CY91248
Standard Package 60
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
Win Source Part Number 1347638-CY91248SZPFV-GS-553E1
Ultra Librarian 3D Model Ultra Librarian CY91248SZPFV-GS-553E1 CAD Model

Description

The CY91248SZPFV-GS-553E1 is a microcontroller from the Infineon Technologies Traveo™ II family, specifically designed for automotive applications requiring high performance, advanced security, and robust networking capabilities. This particular part number represents a unique configuration with tailored memory, peripherals, and packaging to meet specific application needs within the automotive sector.

Applications:

  • Automotive Body Control Modules: Efficiently manages a variety of vehicle body functions, including lighting systems, window lifts, door locking mechanisms, and wiper systems.
  • Gateway Control Units: Facilitates seamless communication between different automotive networks, supporting protocols like CAN, LIN, and Ethernet for comprehensive vehicle connectivity.
  • Advanced Driver Assistance Systems (ADAS): Enables the implementation of ADAS features such as sensor fusion, object detection, and control algorithms, contributing to enhanced vehicle safety and driver assistance (capabilities depend on the specific feature set).
  • Hybrid and Electric Vehicle (HEV/EV) Control Systems: Supports various control functions within HEV/EV powertrains, including battery management systems and motor control units.
  • Automotive Instrument Clusters: Drives high-resolution displays and manages communication with the vehicle's central control system to provide drivers with critical information.

Features:

  • ARM Cortex-M7 Core: Delivers exceptional processing power for demanding automotive applications requiring real-time performance and complex calculations.
  • Integrated Flash Memory: Provides ample on-chip storage for program code and data, reducing the need for external memory components and simplifying system design.
  • SRAM: Offers fast-access memory for efficient runtime data storage and manipulation.
  • Advanced Connectivity Options: Incorporates a range of communication interfaces, including CAN FD, Ethernet, LIN, and SPI, enabling high-speed and reliable data exchange within the vehicle network.
  • Hardware Security Module (HSM): Implements hardware-based security features to ensure secure boot processes, secure communication channels, and robust data protection against unauthorized access and tampering.
  • Functional Safety Features: Designed with safety mechanisms to support ASIL-B or higher safety levels, catering to safety-critical automotive applications that demand adherence to stringent safety standards.
  • Comprehensive Peripheral Set: Includes a versatile array of peripherals, such as ADC (Analog-to-Digital Converter), DAC (Digital-to-Analog Converter), timers, and PWM (Pulse-Width Modulation) units, providing flexibility for diverse control and monitoring tasks.

Benefits:

  • High-Performance Computing: The ARM Cortex-M7 core enables the execution of complex algorithms and real-time control tasks with speed and efficiency.
  • Enhanced System Security: Hardware-based security features protect against unauthorized access, data breaches, and malicious attacks, ensuring the integrity of the vehicle's electronic systems.
  • High-Speed Networking: The integration of CAN FD and Ethernet interfaces facilitates high-bandwidth communication within the vehicle, enabling advanced functionalities and data sharing.
  • Functional Safety Compliance: The inclusion of functional safety features simplifies the development of safety-critical applications and ensures adherence to industry safety standards.
  • Cost-Effective Design: The integration of memory and peripherals minimizes the need for external components, reducing overall system cost and complexity.

Technical Specifications (Typical):

  • CPU Core: ARM Cortex-M7
  • Flash Memory Capacity: Capacity varies depending on the configuration, ranging from several hundred kilobytes to multiple megabytes.
  • SRAM Capacity: Varies depending on the configuration.
  • Operating Voltage: Typically 3.3V or 5V.
  • Operating Temperature Range: -40°C to +125°C (Automotive Temperature Grade).
  • Package Type: QFP (Quad Flat Package) or similar surface-mount package (SZPFV indicates the specific package type).
  • Communication Interfaces: CAN, CAN FD, Ethernet, LIN, SPI, UART.

Note: It is crucial to consult the official Infineon Technologies datasheet for the specific part number CY91248SZPFV-GS-553E1 to obtain the most accurate and detailed technical specifications, pinout diagrams, application notes, and safety guidelines.

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