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M56747BFP T31G

Part No M56747BFP T31G
Manufacturer Mitsubishi
Catalog Misc Products
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Manufacturer Mitsubishi
Popularity Low
Supply and Demand Status Balance
Win Source Part Number 829324-M56747BFP T31G
Ultra Librarian 3D Model Ultra Librarian M56747BFP T31G CAD Model

Description

The M56747BFP T31G is a single-in-line package intelligent power module (IPM) manufactured by Mitsubishi. This module is designed for driving small capacity motors, particularly in applications requiring efficient and reliable motor control. It integrates drive and protection circuitry, simplifying the design and implementation of motor drive systems.

Applications

  • Small capacity motor drives
  • Air conditioners
  • Washing machines
  • Refrigerators
  • Fan motors

Features

  • Integrated gate drive circuits
  • Built-in protection functions: Over-current, short-circuit, and under-voltage protection
  • Single-in-line package for easy mounting
  • Low power loss due to optimized IGBT and diode characteristics
  • Bootstrap diode included for high-side gate drive
  • Compact design for space-constrained applications

Benefits

  • Simplified system design: Reduces the number of external components required
  • Enhanced reliability: Integrated protection features prevent damage to the module and the motor
  • Improved efficiency: Low power loss results in energy savings
  • Reduced size: Compact package allows for smaller product designs
  • Cost-effective solution: Integrates multiple functions into a single module

Additional Details

The M56747BFP T31G typically operates with a supply voltage in the range of 200-450V DC. It includes an IGBT inverter bridge and the necessary gate drive and protection circuitry for each IGBT. The module is designed to be directly mounted onto a heatsink for effective thermal management. The integrated protection features are crucial in preventing damage to the module and the connected motor in case of fault conditions. The bootstrap circuit simplifies the high-side gate drive implementation, reducing component count and board space.

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Shipping Information

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